Texas Instruments SimpleLink CC2650, Manual

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Page: 14 / 71

Texas Instruments SimpleLink CC2650 Manual Download Page 14

14

SWRS158B – FEBRUARY 2015 – REVISED JULY 2016

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Specifications

Copyright © 2015–2016, Texas Instruments Incorporated

(1)

Single-ended RF mode is optimized for size and power consumption. Measured on CC2650EM-4XS.

(2)

Differential RF mode is optimized for RF performance. Measured on CC2650EM-5XD.

(3)

I

peri

is not supported in Standby or Shutdown.

5.4

Power Consumption Summary

Measured on the TI CC2650EM-5XD reference design with T

c

= 25°C, V

DDS

= 3.0 V with internal DC-DC converter, unless

otherwise noted.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

I

core

Core current consumption

Reset. RESET_N pin asserted or VDDS below
Power-on-Reset threshold

100

nA

Shutdown. No clocks running, no retention

150

Standby. With RTC, CPU, RAM and (partial)
register retention. RCOSC_LF

1

µA

Standby. With RTC, CPU, RAM and (partial)
register retention. XOSC_LF

1.2

Standby. With Cache, RTC, CPU, RAM and
(partial) register retention. RCOSC_LF

2.5

Standby. With Cache, RTC, CPU, RAM and
(partial) register retention. XOSC_LF

2.7

Idle. Supply Systems and RAM powered.

550

Active. Core running CoreMark

1.45 mA +

31 µA/MHz

Radio RX

(1)

5.9

mA

Radio RX

(2)

6.1

Radio TX, 0-dBm output power

(1)

6.1

Radio TX, 5-dBm output power

(2)

9.1

Peripheral Current Consumption (Adds to core current I

core

for each peripheral unit activated)

(3)

I

peri

Peripheral power domain

Delta current with domain enabled

20

µA

Serial power domain

Delta current with domain enabled

13

µA

RF Core

Delta current with power domain enabled, clock
enabled, RF core idle

237

µA

µDMA

Delta current with clock enabled, module idle

130

µA

Timers

Delta current with clock enabled, module idle

113

µA

I

2

C

Delta current with clock enabled, module idle

12

µA

I2S

Delta current with clock enabled, module idle

36

µA

SSI

Delta current with clock enabled, module idle

93

µA

UART

Delta current with clock enabled, module idle

164

µA

(1)

This number is dependent on Flash aging and will increase over time and erase cycles.

5.5

General Characteristics

Measured on the TI CC2650EM-5XD reference design with T

c

= 25°C, V

DDS

= 3.0 V, unless otherwise noted.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

FLASH MEMORY

Supported flash erase cycles before
failure

100

k Cycles

Flash page/sector erase current

Average delta current

12.6

mA

Flash page/sector size

4

KB

Flash write current

Average delta current, 4 bytes at a time

8.15

mA

Flash page/sector erase time

(1)

8

ms

Flash write time

(1)

4 bytes at a time

8

µs

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Summary of Contents for SimpleLink CC2650

Page 1: ...28 Security Module True Random Number Generator TRNG 10 15 or 31 GPIOs Depending on Package Option Support for Eight Capacitive Sensing Buttons Integrated Temperature Sensor External System On Chip internal DC DC Converter Very Few External Components Seamless Integration With the SimpleLink CC2590 and CC2592 Range Extenders Pin Compatible With the SimpleLink CC13xx in 4 mm 4 mm and 5 mm 5 mm VQFN...

Page 2: ...or operation on small coin cell batteries and in energy harvesting applications The CC2650 device contains a 32 bit ARM Cortex M3 processor that runs at 48 MHz as the main processor and a rich peripheral feature set that includes a unique ultralow power sensor controller This sensor controller is ideal for interfacing external sensors and for collecting analog and digital data autonomously while t...

Page 3: ...r General peripherals modules 4 32 bit Timers 2 SSI SPI µW TI Watchdog timer Temp batt monitor RTC I2C UART I2S 10 15 31 GPIOs AES 32 ch µDMA ADC Digital PLL TRNG ADC 8KB cache Copyright 2016 Texas Instruments Incorporated 3 CC2650 www ti com SWRS158B FEBRUARY 2015 REVISED JULY 2016 Submit Documentation Feedback Product Folder Links CC2650 Device Overview Copyright 2015 2016 Texas Instruments Inco...

Page 4: ...tor XOSC_LF 20 5 16 48 MHz RC Oscillator RCOSC_HF 21 5 17 32 kHz RC Oscillator RCOSC_LF 21 5 18 ADC Characteristics 21 5 19 Temperature Sensor 23 5 20 Battery Monitor 23 5 21 Continuous Time Comparator 23 5 22 Low Power Clocked Comparator 24 5 23 Programmable Current Source 24 5 24 Synchronous Serial Interface SSI 24 5 25 DC Characteristics 26 5 26 Thermal Resistance Characteristics 27 5 27 Timing...

Page 5: ...the TX Current Consumption vs Supply Voltage VDDS graph 29 Changed Figure 5 14 Receive Mode Current vs Supply Voltage VDDS 29 Added Figure 5 24 Supply Current vs Temperature 31 Changes from February 21 2015 to October 15 2015 Page Removed RHB package option from CC2620 6 Added motional inductance recommendation to the 24 MHz XOSC table 20 Added SPI timing parameters 24 Added VOH and VOL min and ma...

Page 6: ...ion The offerings range from fully customized solutions to turn key offerings with pre certified hardware and software protocol Sub 1 GHz Long range low power wireless connectivity solutions are offered in a wide range of Sub 1 GHz ISM bands Companion Products Review products that are frequently purchased or used in conjunction with this product SimpleLink CC2650 Wireless MCU LaunchPad Kit The CC2...

Page 7: ...cuitry from this pin 4 Terminal Configuration and Functions 4 1 Pin Diagram RGZ Package Note I O pins marked in bold have high drive capabilities I O pins marked in italics have analog capabilities Figure 4 1 RGZ Package 48 Pin VQFN 7 mm 7 mm Pinout 0 5 mm Pitch 4 2 Signal Descriptions RGZ Package Table 4 1 Signal Descriptions RGZ Package NAME NO TYPE DESCRIPTION DCDC_SW 33 Power Output from inter...

Page 8: ...igital Analog I O GPIO Sensor Controller Analog DIO_27 40 Digital Analog I O GPIO Sensor Controller Analog DIO_28 41 Digital Analog I O GPIO Sensor Controller Analog DIO_29 42 Digital Analog I O GPIO Sensor Controller Analog DIO_30 43 Digital Analog I O GPIO Sensor Controller Analog JTAG_TMSC 24 Digital I O JTAG TMSC high drive capability JTAG_TCKC 25 Digital I O JTAG TCKC RESET_N 35 Digital input...

Page 9: ...s RHB Package NAME NO TYPE DESCRIPTION DCDC_SW 17 Power Output from internal DC DC 1 DCOUPL 12 Power 1 27 V regulated digital supply decoupling 2 DIO_0 6 Digital I O GPIO Sensor Controller DIO_1 7 Digital I O GPIO Sensor Controller DIO_2 8 Digital I O GPIO Sensor Controller high drive capability DIO_3 9 Digital I O GPIO Sensor Controller high drive capability DIO_4 10 Digital I O GPIO Sensor Contr...

Page 10: ... LNA during RX Negative RF output signal to PA during TX RF_P 1 RF I O Positive RF input signal to LNA during RX Positive RF output signal to PA during TX RX_TX 3 RF I O Optional bias pin for the RF LNA VDDR 29 Power 1 7 V to 1 95 V supply typically connect to output of internal DC DC 3 2 VDDR_RF 32 Power 1 7 V to 1 95 V supply typically connect to output of internal DC DC 2 4 VDDS 28 Power 1 8 V ...

Page 11: ...RIPTION DCDC_SW 18 Power Output from internal DC DC 1 Tie to ground for external regulator mode 1 7 V to 1 95 V operation DCOUPL 12 Power 1 27 V regulated digital supply decoupling capacitor 2 DIO_0 8 Digital I O GPIO Sensor Controller high drive capability DIO_1 9 Digital I O GPIO Sensor Controller high drive capability DIO_2 10 Digital I O GPIO Sensor Controller high drive capability DIO_3 15 Di...

Page 12: ...l bias pin for the RF LNA VDDR 28 Power 1 7 V to 1 95 V supply typically connect to output of internal DC DC 2 3 VDDR_RF 32 Power 1 7 V to 1 95 V supply typically connect to output of internal DC DC 2 4 VDDS 27 Power 1 8 V to 3 8 V main chip supply 1 VDDS2 11 Power 1 8 V to 3 8 V GPIO supply 1 VDDS_DCDC 19 Power 1 8 V to 3 8 V DC DC supply Tie to ground for external regulator mode 1 7 V to 1 95 V ...

Page 13: ...mode VDDS and VDDR pins connected on PCB 0 3 2 25 V Voltage on any digital pin 4 5 0 3 VDDSx 0 3 max 4 1 V Voltage on crystal oscillator pins X32K_Q1 X32K_Q2 X24M_N and X24M_P 0 3 VDDR 0 3 max 2 25 V Voltage on ADC input Vin Voltage scaling enabled 0 3 VDDS V Voltage scaling disabled internal reference 0 3 1 49 Voltage scaling disabled VDDS as reference 0 3 VDDS 2 9 Input RF level 5 dBm Tstg Stora...

Page 14: ... 31 µA MHz Radio RX 1 5 9 mA Radio RX 2 6 1 Radio TX 0 dBm output power 1 6 1 Radio TX 5 dBm output power 2 9 1 Peripheral Current Consumption Adds to core current Icore for each peripheral unit activated 3 Iperi Peripheral power domain Delta current with domain enabled 20 µA Serial power domain Delta current with domain enabled 13 µA RF Core Delta current with power domain enabled clock enabled R...

Page 15: ...MHz 1 Wanted signal at 67 dBm modulated interferer at 1 MHz BER 10 3 7 3 2 dB Selectivity 2 MHz 1 Wanted signal at 67 dBm modulated interferer at 2 MHz BER 10 3 34 25 2 dB Selectivity 3 MHz 1 Wanted signal at 67 dBm modulated interferer at 3 MHz BER 10 3 38 26 2 dB Selectivity 4 MHz 1 Wanted signal at 67 dBm modulated interferer at 4 MHz BER 10 3 42 29 2 dB Selectivity 5 MHz or more 1 Wanted signa...

Page 16: ...eiver sensitivity Differential mode Measured at the CC2650EM 5XD SMA connector BER 10 3 92 dBm Receiver saturation Differential mode Measured at the CC2650EM 5XD SMA connector BER 10 3 4 dBm Frequency error tolerance Difference between the incoming carrier frequency and the internally generated carrier frequency 300 500 kHz Data rate error tolerance Difference between incoming data rate and the in...

Page 17: ... noted PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Receiver sensitivity Differential mode Measured at the CC2650EM 5XD SMA connector BER 10 3 81 dBm Receiver saturation Differential mode Measured at the CC2650EM 5XD SMA connector BER 10 3 11 dBm Frequency error tolerance Difference between the incoming carrier frequency and the internally generated carrier frequency 300 300 kHz Data rate error tole...

Page 18: ...c 25 C VDDS 3 0 V fRF 2440 MHz unless otherwise noted PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Output power highest setting Differential mode delivered to a single ended 50 Ω load through a balun 5 dBm Output power highest setting Measured on CC2650EM 4XS delivered to a single ended 50 Ω load 2 dBm Output power lowest setting Delivered to a single ended 50 Ω load through a balun 21 dBm Occupied ...

Page 19: ...d desensitization 5 MHz from lower band edge Wanted signal at 97 dBm 3 dB above the sensitivity level CW jammer PER 1 63 dB Blocking and desensitization 10 MHz from lower band edge Wanted signal at 97 dBm 3 dB above the sensitivity level CW jammer PER 1 63 dB Blocking and desensitization 20 MHz from lower band edge Wanted signal at 97 dBm 3 dB above the sensitivity level CW jammer PER 1 65 dB Bloc...

Page 20: ... over temperature ageing and frequency pulling due to incorrect load capacitance As per Bluetooth and IEEE 802 15 4 specification 5 Kick started based on a temperature and aging compensated RCOSC_HF using precharge injection 5 14 24 MHz Crystal Oscillator XOSC_HF Tc 25 C VDDS 3 0 V unless otherwise noted 1 PARAMETER TEST CONDITIONS MIN TYP MAX UNIT ESR Equivalent series resistance 2 6 pF CL 9 pF 2...

Page 21: ...e DNL typically varies from 0 3 to 3 5 depending on device see Figure 5 25 4 For a typical example see Figure 5 26 5 18 ADC Characteristics Tc 25 C VDDS 3 0 V and voltage scaling enabled unless otherwise noted 1 PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Input voltage range 0 VDDS V Resolution 12 Bits Sample rate 200 ksps Offset Internal 4 3 V equivalent reference 2 2 LSB Gain error Internal 4 3 V...

Page 22: ...eference input voltage scaling enabled For best accuracy the ADC conversion should be initiated through the TIRTOS API in order to include the gain offset compensation factors stored in FCFG1 4 3 2 5 V Reference voltage Fixed internal reference input voltage scaling disabled For best accuracy the ADC conversion should be initiated through the TIRTOS API in order to include the gain offset compensa...

Page 23: ...oltage coefficient 1 3 2 C V 5 20 Battery Monitor Measured on the TI CC2650EM 5XD reference design with Tc 25 C VDDS 3 0 V unless otherwise noted PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Resolution 50 mV Range 1 8 3 8 V Accuracy 13 mV 1 Additionally the bias module must be enabled when running in standby mode 5 21 Continuous Time Comparator Tc 25 C VDDS 3 0 V unless otherwise noted PARAMETER TES...

Page 24: ...g in standby mode 5 23 Programmable Current Source Tc 25 C VDDS 3 0 V unless otherwise noted PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Current source programmable output range 0 25 20 µA Resolution 0 25 µA Current consumption 1 Including current source at maximum programmable output 23 µA 1 Refer to SSI timing diagrams Figure 5 1 Figure 5 2 and Figure 5 3 5 24 Synchronous Serial Interface SSI Tc ...

Page 25: ...its 25 CC2650 www ti com SWRS158B FEBRUARY 2015 REVISED JULY 2016 Submit Documentation Feedback Product Folder Links CC2650 Specifications Copyright 2015 2016 Texas Instruments Incorporated Figure 5 1 SSI Timing for TI Frame Format FRF 01 Single Transfer Timing Measurement Figure 5 2 SSI Timing for MICROWIRE Frame Format FRF 10 Single Transfer ...

Page 26: ...1 32 1 54 V GPIO VOL at 8 mA load IOCURR 2 high drive GPIOs only 0 26 0 32 V GPIO VOH at 4 mA load IOCURR 1 1 32 1 58 V GPIO VOL at 4 mA load IOCURR 1 0 21 0 32 V GPIO pullup current Input mode pullup enabled Vpad 0 V 71 7 µA GPIO pulldown current Input mode pulldown enabled Vpad VDDS 21 1 µA GPIO high low input transition no hysteresis IH 0 transition between reading 0 and reading 1 0 88 V GPIO l...

Page 27: ...5 C VIH Lowest GPIO input voltage reliably interpreted as a High 0 8 VDDS 1 VIL Highest GPIO input voltage reliably interpreted as a Low 0 2 VDDS 1 1 C W degrees Celsius per watt 2 These values are based on a JEDEC defined 2S2P system with the exception of the Theta JC RθJC value which is based on a JEDEC defined 1S0P system and will change based on environment as well as application For more info...

Page 28: ...ction 5 17 3 TA 40 C to 85 C VDDS 1 7 V to 3 8 V unless otherwise noted 5 27 Timing Requirements MIN NOM MAX UNIT Rising supply voltage slew rate 0 100 mV µs Falling supply voltage slew rate 0 20 mV µs Falling supply voltage slew rate with low power flash settings 1 3 mV µs Positive temperature gradient in standby 2 No limitation for negative temperature gradient or outside standby mode 5 C s CONT...

Page 29: ...itivity dBm 40 30 20 10 0 10 20 30 40 50 60 70 80 99 98 97 96 95 94 Sensitivity 4XS Sensitivity 5XD Temperature qC Sensitivity dBm 40 30 20 10 0 10 20 30 40 50 60 70 80 103 102 101 100 99 98 97 96 95 Sensitivity 4XS Sensitivity 5XD 29 CC2650 www ti com SWRS158B FEBRUARY 2015 REVISED JULY 2016 Submit Documentation Feedback Product Folder Links CC2650 Specifications Copyright 2015 2016 Texas Instrum...

Page 30: ...ng VDDS V Output power dBm 1 8 2 3 2 8 3 3 3 8 0 1 2 3 4 5 6 D003 5XD 5 dBm Setting 4XS 2 dBm Setting Temperature qC Output Power dBm 40 30 20 10 0 10 20 30 40 50 60 70 80 0 1 2 3 4 5 6 4XS 2 dBm Setting 5XD 5 dBm Setting 30 CC2650 SWRS158B FEBRUARY 2015 REVISED JULY 2016 www ti com Submit Documentation Feedback Product Folder Links CC2650 Specifications Copyright 2015 2016 Texas Instruments Incor...

Page 31: ...e qC Active Mode Current Consumpstion mA 40 30 20 10 0 10 20 30 40 50 60 70 80 2 85 2 9 2 95 3 3 05 3 1 D006 Active Mode Current 31 CC2650 www ti com SWRS158B FEBRUARY 2015 REVISED JULY 2016 Submit Documentation Feedback Product Folder Links CC2650 Specifications Copyright 2015 2016 Texas Instruments Incorporated Typical Characteristics continued Figure 5 16 TX Mode Current Consumption vs Temperat...

Page 32: ... Internal Reference No Averaging ENOB Internal Reference 32 Samples Averaging 32 CC2650 SWRS158B FEBRUARY 2015 REVISED JULY 2016 www ti com Submit Documentation Feedback Product Folder Links CC2650 Specifications Copyright 2015 2016 Texas Instruments Incorporated Typical Characteristics continued Figure 5 22 SoC ADC Output vs Temperature Fixed Input Internal Reference No Scaling Figure 5 23 SoC AD...

Page 33: ...0 3200 3400 3600 3800 4000 4200 1 5 1 0 5 0 0 5 1 1 5 2 2 5 3 3 5 D010 33 CC2650 www ti com SWRS158B FEBRUARY 2015 REVISED JULY 2016 Submit Documentation Feedback Product Folder Links CC2650 Specifications Copyright 2015 2016 Texas Instruments Incorporated Typical Characteristics continued Figure 5 25 SoC ADC DNL vs ADC Code Internal Reference No Scaling Figure 5 26 SoC ADC INL vs ADC Code Interna...

Page 34: ...modules 4 32 bit Timers 2 SSI SPI µW TI Watchdog timer Temp batt monitor RTC I2C UART I2S 10 15 31 GPIOs AES 32 ch µDMA ADC Digital PLL TRNG ADC 8KB cache Copyright 2016 Texas Instruments Incorporated 34 CC2650 SWRS158B FEBRUARY 2015 REVISED JULY 2016 www ti com Submit Documentation Feedback Product Folder Links CC2650 Detailed Description Copyright 2015 2016 Texas Instruments Incorporated 6 Detai...

Page 35: ...ta to be efficiently packed into memory Fast code execution permits slower processor clock or increases sleep mode time Harvard architecture characterized by separate buses for instruction and data Efficient processor core system and memories Hardware division and fast digital signal processing oriented multiply accumulate Saturating arithmetic for signal processing Deterministic high performance ...

Page 36: ... provides application examples for some of these use cases but not for all of them The peripherals in the Sensor Controller include the following The low power clocked comparator can be used to wake the device from any state in which the comparator is active A configurable internal reference can be used in conjunction with the comparator The output of the comparator can also be used to trigger an ...

Page 37: ...emory provides nonvolatile storage for code and data The flash memory is in system programmable The SRAM static RAM can be used for both storage of data and execution of code and is split into two 4 KB blocks and two 6 KB blocks Retention of the RAM contents in standby mode can be enabled or disabled individually for each block to minimize power consumption In addition if flash cache is disabled t...

Page 38: ... Clock XOSC_LF or RCOSC_LF XOSC_LF or RCOSC_LF XOSC_LF or RCOSC_LF Off Off Peripherals Available Available Off Off Off Sensor Controller Available Available Available Off Off Wake up on RTC Available Available Available Off Off Wake up on Pin Edge Available Available Available Available Off Wake up on Reset Pin Available Available Available Available Available Brown Out Detector BOD Active Active ...

Page 39: ...pherals to be assigned to I O pins in a flexible manner All digital I Os are interrupt and wake up capable have a programmable pullup and pulldown function and can generate an interrupt on a negative or positive edge configurable When configured as an output pins can function as either push pull or open drain Five GPIOs have high drive capabilities marked in bold in Section 4 The SSIs are synchron...

Page 40: ...ith software support the RTC can be used for clock and calendar operation The RTC is clocked from the 32 kHz RC oscillator or crystal The RTC can also be compensated to tick at the correct frequency even when the internal 32 kHz RC oscillator is used instead of a crystal The battery monitor and temperature sensor are accessible by software and give a battery status indication as well as a coarse t...

Page 41: ...f the TI component specification and TI does not warrant its accuracy or completeness TI s customers are responsible for determining suitability of components for their purposes Customers should validate and test their design implementation to confirm system functionality 7 1 Application Information Very few external components are required for the operation of the CC2650 device This section provi...

Page 42: ...RF P Pin 2 RF N 24 MHz XTAL Load Caps on Chip VDDS_DCDC Pin CC26xx 2 2 F DCDC_SW Pin 1 7 V 1 95 V to All VDDR and VDDS Pins Except VDDS_DCDC Ext Regulator Copyright 2016 Texas Instruments Incorporated 42 CC2650 SWRS158B FEBRUARY 2015 REVISED JULY 2016 www ti com Submit Documentation Feedback Product Folder Links CC2650 Application Implementation and Layout Copyright 2015 2016 Texas Instruments Inc...

Page 43: ...1 1 pF C21 1 pF C20 100 nF X24M_N X24M_P VDDS VDDR DCDC_SW DCDC_SW C31 6 8 pF VDDS nRESET C19 1 µF JTAG_TCK JTAG_TMS DIO_1 DIO_0 DIO_3 DIO_2 DIO_5 JTAG_TDO DIO_4 DIO_7 DIO_6 JTAG_TDI DIO_10 DIO_9 DIO_8 DIO_12 DIO_11 DIO_14 DIO_13 RX_TX RFP RFN L11 2 7 nH 1 2 L21 2 4 nH 1 2 VDD_EB FL1 BLM18HE152SN1 1 2 C9 100 nF C3 100 nF C4 100 nF VDDS Decoupling Capacitors Pin 18 Pin 28 Pin 11 C7 100 nF L10 6 2 n...

Page 44: ...EVISED JULY 2016 www ti com Submit Documentation Feedback Product Folder Links CC2650 Application Implementation and Layout Copyright 2015 2016 Texas Instruments Incorporated 7 2 1 Layout Figure 7 4 5 5 External Differential 5XD Layout ...

Page 45: ...0 8 DIO_1 9 DIO_2 10 DIO_3 15 DIO_4 16 DIO_5 22 DIO_6 23 DIO_7 24 DIO_8 25 DIO_9 26 RESET_N 21 JTAG_TCKC 14 JTAG_TMSC 13 X24M_P 31 X24M_N 30 DCOUPL 12 VSS 29 VSS 3 EGP 33 VDDS 27 VDDS2 11 VDDS_DCDC 19 VDDR 28 VDDR 32 DCDC_SW 18 RX TX 4 RF_N RF_P 1 X32K_Q2 6 X32K_Q1 5 VSS 7 VSS 17 VSS 20 DIO_1 DIO_3 JTAG_TDO DIO_2 DIO_6 DIO_5 DIO_4 JTAG_TDI DCDC_SW JTAG_TCK nRESET JTAG_TMS C23 DNM C22 DNM X24M_N X2...

Page 46: ...EVISED JULY 2016 www ti com Submit Documentation Feedback Product Folder Links CC2650 Application Implementation and Layout Copyright 2015 2016 Texas Instruments Incorporated 7 3 1 Layout Figure 7 6 4 4 External Single ended 4XS Layout ...

Page 47: ...w X Experimental device that is not necessarily representative of the final device s electrical specifications and may not use production assembly flow P Prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications null Production version of the silicon die that is fully qualified Production devices have been characterized fully and th...

Page 48: ... the CC26xx which can perform simple background tasks autonomously and independent of the System CPU state Allows for Sensor Controller task algorithms to be implemented using a C like programming language Outputs a Sensor Controller Interface driver which incorporates the generated Sensor Controller machine code and associated definitions Allows for rapid development by using the integrated Senso...

Page 49: ... 8 6 Community Resources The following links connect to TI community resources Linked contents are provided AS IS by the respective contributors They do not constitute TI specifications and do not necessarily reflect TI s views see TI s Terms of Use TI E2E Online Community TI s Engineer to Engineer E2E Community Created to foster collaboration among engineers At e2e ti com you can ask questions sh...

Page 50: ...itute of Electrical and Electronics Engineers Incorporated ZigBee is a registered trademark of ZigBee Alliance Inc All other trademarks are the property of their respective owners 8 9 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD Texas Instruments recommends that all integrated circuits be handled with appropriate precautions Failure to observe proper handling and i...

Page 51: ... planned eco friendly classification Pb Free RoHS Pb Free RoHS Exempt or Green RoHS no Sb Br please check http www ti com productcontent for the latest availability information and additional product content details TBD The Pb Free Green conversion plan has not been defined Pb Free RoHS TI s terms Lead Free or Pb Free mean semiconductor products that are compatible with the current RoHS requiremen...

Page 52: ...third parties and makes no representation or warranty as to the accuracy of such information Efforts are underway to better integrate information from third parties TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals TI and TI suppliers consider...

Page 53: ... 1 12 0 16 0 Q2 CC2650F128RGZT VQFN RGZ 48 250 180 0 16 4 7 3 7 3 1 1 12 0 16 0 Q2 CC2650F128RHBR VQFN RHB 32 3000 330 0 12 4 5 3 5 3 1 1 8 0 12 0 Q2 CC2650F128RHBT VQFN RHB 32 250 180 0 12 4 5 3 5 3 1 1 8 0 12 0 Q2 CC2650F128RSMR VQFN RSM 32 3000 330 0 12 4 4 25 4 25 1 15 8 0 12 0 Q2 CC2650F128RSMT VQFN RSM 32 250 180 0 12 4 4 25 4 25 1 15 8 0 12 0 Q2 PACKAGE MATERIALS INFORMATION www ti com 30 N...

Page 54: ... 367 0 367 0 38 0 CC2650F128RGZT VQFN RGZ 48 250 210 0 185 0 35 0 CC2650F128RHBR VQFN RHB 32 3000 367 0 367 0 35 0 CC2650F128RHBT VQFN RHB 32 250 210 0 185 0 35 0 CC2650F128RSMR VQFN RSM 32 3000 367 0 367 0 35 0 CC2650F128RSMT VQFN RSM 32 250 210 0 185 0 35 0 PACKAGE MATERIALS INFORMATION www ti com 30 Nov 2015 Pack Materials Page 2 ...

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Page 64: ...esponsible for compliance with all legal regulatory and safety related requirements concerning its products and any use of TI components in its applications notwithstanding any applications related information or support that may be provided by TI Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failur...

Page 65: ...o the CC2650 Datasheet for additional details NOTE Some LaunchPads BoosterPacks do not comply 100 with the standard so please check your specific LaunchPad to ensure pin compatibility For information about pins and compability please go to dev ti com bpchecker Timer Capture Timer Capture GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO SPI CS Wireless SPI CS Display SPI CS Other GND GPIO GPIO GPI...

Page 66: ... 0 For rev 1 1 of the LaunchPad only Go to dev ti com launchxl cc2650 and upgrade the firmware via USB before using the LaunchPad with the Simplelink Starter app Ready to Learn More Documentation TI RTOS Drivers Bluetooth Smart Code Examples Application Notes Design Files and more CC2650 Launchpad Overview dev ti com launchxl cc2650 A closer look at your new LaunchPad Development Kit Featured wire...

Page 67: ...ring the warranty period to the address designated by TI and that are determined by TI not to conform to such warranty If TI elects to repair or replace such EVM TI shall have a reasonable time to repair such EVM or provide replacements Repaired EVMs shall be warranted for the remainder of the original warranty period Replaced EVMs shall be warranted for a new full ninety 90 day warranty period 3 ...

Page 68: ... by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated Antenna types not included in this list having a gain greater than the maximum gain indicated for that type are strictly prohibited for use with this device Concernant les EVMs avec antennes détachables Conformément à la rég...

Page 69: ... connecting any load to the EVM output If there is uncertainty as to the load specification please contact a TI field representative During normal operation even with the inputs and outputs kept within the specified allowable ranges some circuit components may have elevated case temperatures These components include but are not limited to linear regulators switching transistors pass transistors cu...

Page 70: ...F REMOVAL OR REINSTALLATION ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES RETESTING OUTSIDE COMPUTER TIME LABOR COSTS LOSS OF GOODWILL LOSS OF PROFITS LOSS OF SAVINGS LOSS OF USE LOSS OF DATA OR BUSINESS INTERRUPTION NO CLAIM SUIT OR ACTION SHALL BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED 8 2 Specific Limitations IN NO EVENT SHALL T...

Page 71: ...esponsible for compliance with all legal regulatory and safety related requirements concerning its products and any use of TI components in its applications notwithstanding any applications related information or support that may be provided by TI Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failur...

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