MSP430F42x
MIXED SIGNAL MICROCONTROLLER
SLAS421A − APRIL 2004 − REVISED JUNE 2007
17
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265
absolute maximum ratings
†
Voltage applied at V
CC
to V
SS
−0.3 V to + 4.1 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage applied to any pin (see Note 1)
−0.3 V to V
CC
+ 0.3 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Diode current at any device terminal .
±
2 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature (unprogrammed device)
−55
°
C to 150
°
C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature (programmed device)
−40
°
C to 85
°
C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: All voltages referenced to V
SS
. The JTAG fuse-blow voltage, V
FB
, is allowed to exceed the absolute maximum rating. The voltage is
applied to the TDI/TCLK pin when blowing the JTAG fuse.
recommended operating conditions
PARAMETER
MIN
NOM
MAX
UNITS
Supply voltage during program execution; SD16 disabled.
V
CC
(AV
CC
= DV
CC
= V
CC
) (see Note 1)
MSP430F42x
1.8
3.6
V
Supply voltage during program execution; SD16 disabled, SVS enabled, and
PORON = 1. V
CC
(AV
CC
= DV
CC
= V
CC
) (see Note 1 and Note 2)
MSP430F42x
2.0
3.6
V
Supply voltage during program execution; SD16 enabled or
during programming of flash memory. V
CC
(AV
CC
= DV
CC
= V
CC
)
MSP430F42x
2.7
3.6
V
Supply voltage, V
SS
(AV
SS
= DV
SS
= V
SS
)
0
0
V
Operating free-air temperature range, T
A
MSP430F42x
−40
85
°
C
LF selected, XTS_FLL=0
Watch crystal
32768
Hz
LFXT1 crystal frequency, f
(LFXT1)
(see Note 3)
XT1 selected, XTS_FLL=1
Ceramic resonator
450
8000
kHz
LFXT1 crystal frequency, f
(LFXT1)
(see Note 3)
XT1 selected, XTS_FLL=1
Crystal
1000
8000
kHz
Processor frequency (signal MCLK) f
V
CC
= 1.8 V
DC
4.15
MHz
Processor frequency (signal MCLK), f
(System)
V
CC
= 3.6 V
DC
8
MHz
NOTES:
1. It is recommended to power AV
CC
and DV
CC
from the same source. A maximum difference of 0.3 V between AV
CC
and DV
CC
can
be tolerated during power up and operation.
2. The minimum operating supply voltage is defined according to the trip point where POR is going active by decreasing supply voltage.
POR is going inactive when the supply voltage is raised above minimum supply voltage plus the hysteresis of the SVS circuitry.
3. The LFXT1 oscillator in LF-mode requires a watch crystal.
f (MHz)
1.8 V
3.6 V
2.7 V
3 V
4.15 MHz
8 MHz
V
CC
− Supply Voltage − V
f
System
− Maximum Processor Frequency − MHz
Supply Voltage Range with SD16
Enabled or During Programming
of the Flash Memory
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Supply Voltage Range
During Program
Execution
6 MHz
Figure 1. Frequency vs Supply Voltage