VIN nets are connected to bottom layer with multiple vias. This allows closer placement of the inductors, thus reducing SW node size
and EMI. Also snubber circuits are placed next to SW nets for EMI reduction. Multiple GND vias are used to provide solid ground around
the LP875761-Q1 device.
Figure 6-5. Top Layer
Board Layout
SNVU751 – OCTOBER 2020
The LP875761Q1EVM Evaluation Module
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