1
2
3
4
5
J11
OUT1_P
1
2
3
4
5
J12
OUT1_N
1
2
3
4
5
J10
OUT0_N
OUT0_P
1
2
3
4
5
J9
OUT0_P
0
R56
DNP
0
R57
DNP
0
R58
DNP
1
2
3
4
5
J13
OUT2_P
1
2
3
4
5
J14
OUT2_N
0
R60
DNP
OUT0_N
OUT1_P
OUT1_N
OUT2_P
OUT2_N
1
2
3
4
5
J15
OUT3_P
1
2
3
4
5
J16
OUT3_N
0
R62
DNP
OUT3_P
OUT3_N
1
2
3
4
5
J19
OUT5_P
1
2
3
4
5
J20
OUT5_N
1
2
3
4
5
J18
OUT4_N
OUT4_P
1
2
3
4
5
J17
OUT4_P
1
2
3
4
5
J21
OUT6_P
1
2
3
4
5
J22
OUT6_N
OUT4_N
OUT5_P
OUT5_N
OUT6_P
OUT6_N
1
2
3
4
5
J23
OUT7_P
1
2
3
4
5
J24
OUT7_N
OUT7_P
OUT7_N
CLOCK OUTPUTS
0
R76
DNP
0
R78
DNP
0
R80
DNP
0
R82
DNP
0.1µF
0402
C68
0.1µF
0402
C69
0.1µF
0402
C70
0.1µF
0402
C71
0.1µF
0402
C72
0.1µF
0402
C73
0.1µF
0402
C74
0.1µF
0402
C75
0.1µF
0402
C76
0.1µF
0402
C77
0.1µF
0402
C78
0.1µF
0402
C79
0.1µF
0402
C80
0.1µF
0402
C81
0.1µF
0402
C82
0.1µF
0402
C83
50-ohm (+/-5%) single-ended RF traces
0402
0
R44
0
0402
R64
0402
0
R45
0
0402
R46
0
0402
R47
0
0402
R48
0
0402
R49
0
0402
R50
0
0402
R51
0
0402
R65
0
0402
R66
0
0402
R67
0
0402
R68
0
0402
R69
0
0402
R70
0
0402
R71
R_OUT0_P
R_OUT0_N
R_OUT1_P
R_OUT1_N
R_OUT2_P
R_OUT2_N
R_OUT3_P
R_OUT3_N
R_OUT4_P
R_OUT4_N
R_OUT5_P
R_OUT5_N
R_OUT6_P
R_OUT6_N
R_OUT7_P
R_OUT7_N
CLOCK OUTPUT (OUT#_P, OU T#_N) LAYOUT REQUIREMENTS:
*** CONTROLLED IMPEDANCE ***
- Route as 50-ohm (+/-5% tol.) controlled-impedance single-ended RF traces from DUT pin to SMA center pin.
- Place component pads directly on RF traces (no stubs), match 50-ohm trace width to SMA center pad (25 mils wide), and use 50-ohm Zo via structures.
*** LENGTH / SKEW MATCHING ***
- Match output path lengths between all OUT#_P/_N pairs from DUT to SMA pins (Minimize inter-pair or intra-pair skew).
*** SHIELDING / ISOLATION ***
- Use ground shielding on routing layers with sufficient clearance to not affect controlled impedance of RF traces.
- Use ground stitching vias with 100 mil spacing around RF traces to connect GND shielding on all layers.
- Use sufficient clearance between OUT# paths, as well as from other dynamic signal paths.
- Avoid crossing Digital signal/return paths with clock OUT signal/return paths; if unavoidable, cross at a 90 deg. angle
1
2
3
4
5
J25
STAT0
1
2
3
4
5
J26
STAT1
STATU S OUTPUT (STAT0, STAT1) LAYOUT REQUIREMENTS:
*** CONTROLLED IMPEDANCE ***
- Route as 50-ohm (+/-5% tol.) controlled-impedance single-ended RF traces from DUT pin to SMA center pin.
- Place component pads directly on RF traces (no stubs), match 50-ohm trace width to SMA center pad (25 mils wide), and use 50-ohm Zo via structures.
*** LENGTH / SKEW MATCHING ***
- Match status output path lengths between STAT0 and STAT1 paths from DUT to SMA pins.
*** SHIELDING / ISOLATION ***
- Use ground shielding on routing layers with sufficient clearance to not affect controlled impedance of RF traces.
- Use ground stitching vias with 100 mil spacing around RF traces to tie together GND shielding on all layers.
- Use sufficient clearance between STAT0 and STAT1 paths, as well as from other RF paths.
- Avoid crossing Digital signal/return paths with STATU S signal/return paths; if unavoidable, cross at a 90 deg. angle
R_STAT0
STAT0
STAT1
R_STAT1
STATUS OUTPUTS
0.1µF
0402
C86
0.1µF
0402
C87
8.2pF
0402
C84
DNP
8.2pF
0402
C85
DNP
I=2mA
Yell ow
1
2
D6
STAT0=LO
510
R86
I=2mA
Yell ow
1
2
D7
STAT1=LO
510
R87
STAT0_SW
STAT1_SW
0
0402
R84
0
0402
R85
0
0402
R88
0
0402
R90
VDD_R
4.99k
R89
DNP
4.99k
R91
DNP
1
4
S3A
2
3
S3B
SMA_OUT0_P
SMA_OUT0_N
SMA_OUT1_P
SMA_OUT1_N
SMA_OUT2_P
SMA_OUT2_N
SMA_OUT3_P
SMA_OUT3_N
SMA_OUT4_P
SMA_OUT4_N
SMA_OUT5_P
SMA_OUT5_N
SMA_OUT6_P
SMA_OUT6_N
SMA_OUT7_P
SMA_OUT7_N
SMA_STAT0
SMA_STAT1
100
R52
100
R53
100
R54
100
R55
100
R72
100
R73
100
R74
100
R75
0
R59
DNP
0
R61
DNP
0
R63
DNP
0
R77
DNP
0
R79
DNP
0
R81
DNP
0
R83
DNP
EVM Schematic
36
LMK03328EVM User’s Guide
SNAU184 – August 2015
Copyright © 2015, Texas Instruments Incorporated