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STANDARD TERMS FOR EVALUATION MODULES

1.

Delivery:

TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or

documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.

1.1

EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software

1.2

EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.

2

Limited Warranty and Related Remedies/Disclaimers

:

2.1

These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.

2.2

TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
techniques

are

used

to

the

extent

TI

deems

necessary.

TI

does

not

test

all

parameters

of

each

EVM.

User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.

2.3

TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.

3

Regulatory Notices:

3.1

United States

3.1.1

Notice applicable to EVMs not FCC-Approved:

FCC NOTICE:

This kit is designed to allow product developers to evaluate electronic components, circuitry, or software

associated with the kit to determine whether to incorporate such items in a finished product and software developers to write
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or
otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must
operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.

3.1.2

For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:

CAUTION

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.

Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.

FCC Interference Statement for Class A EVM devices

NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.

Summary of Contents for HSS-MOTHERBOARDEVM

Page 1: ...nt description schematic bill of materials BOM and board layout of the EVM NOTE This EVM does NOT come with devices populated on the board The user MUST order samples separately Contents 1 Introduction 2 1 1 Descriptions 2 1 2 Applications 2 1 3 Features 3 2 HSS MOTHERBOARDEVM Schematic 4 3 Connections Descriptions 7 3 1 Connectors and Test Points 7 3 2 Jumpers 8 4 TPS2HB08 50EVM EVM Assembly Draw...

Page 2: ...in power pad on the back needs to be soldered correctly as to not affect performance Please see PowerPAD Thermally Enhanced Package app note for more details about the solder profile and techniques The current limiting resistors are on the bottom side of the daughterboard They are all 10 kΩ 0805 package For the desired current limit value the resistor can be replaced with different value Also for ...

Page 3: ...d 5 V logic compatible High accuracy current sense Analog current sense as a ratio of the load current or device temperature Protection Reverse battery protection with external ground network Short circuit protection Overvoltage protection Thermal shutdown and thermal swing with self recovery ESD protection Diagnostic On and off state output open or short to battery detection Overload and short to...

Page 4: ...December 2018 Submit Documentation Feedback Copyright 2018 Texas Instruments Incorporated High Side Switch Motherboard Evaluation Module 2 HSS MOTHERBOARDEVM Schematic Figure 1 and Figure 2 illustrate the TPS2HB08 50EVM motherboard and daughterboard schematics respectively ...

Page 5: ...M Schematic 5 SLVUBD4A January 2018 Revised December 2018 Submit Documentation Feedback Copyright 2018 Texas Instruments Incorporated High Side Switch Motherboard Evaluation Module Figure 1 HSS MOTHERBOARDEVM Motherboard Schematic ...

Page 6: ...ti com 6 SLVUBD4A January 2018 Revised December 2018 Submit Documentation Feedback Copyright 2018 Texas Instruments Incorporated High Side Switch Motherboard Evaluation Module Figure 2 HSS MOTHERBOARDEVM Sample Daughter Card Schematic ...

Page 7: ...tage Vout2_Sense TP12 Test point to measure VOUT2 Voltage EN1 TP3 Test point used to apply power to EN1 only use when J9 is not connected to 5V or GND EN2 TP7 Test point used to apply power to EN2 only use when J13 is not connected to 5V or GND Only for 2 channel devices DIA_EN TP4 Test point used to apply power to DIA_EN only use when J10 is not connected to 5 V or GND SEL1 TP5 Test point used to...

Page 8: ...o connect the SEL1 pin to 5 V 1 2 or GND 2 3 J11 This jumper is used to connect SEL2 pin to 5 V 1 2 or GND 2 3 J4 This jumper connects the TLV70450DBVR ground pin 1 to EVM GND This with J5 enables LDO J24 This jumper is used to bypass the ground network used for reverse polarity protection J3 This jumper is used to power the 5 V TLV70450DBVR LDO with the VBB input for the EVM J8 This jumper is use...

Page 9: ...out Figure 3 show the design of the HSS MOTHERBOARDEVM and daughterboard PCB The EVM was designed using FR4 material on a two layer board All components are located in an active area on the top side and active traces are provided in the top and bottom layers to allow the user to easily view probe and evaluate Moving components to both sides of the PCB can offer additional size reduction for space ...

Page 10: ...yout www ti com 10 SLVUBD4A January 2018 Revised December 2018 Submit Documentation Feedback Copyright 2018 Texas Instruments Incorporated High Side Switch Motherboard Evaluation Module Figure 4 HSS MOTHERBOARDEVM Layout and Routing Bottom View ...

Page 11: ...on The HSS MOTHERBOARDEVM comes with large footprints for TVS diodes if they are needed for any transient testing D3 is an SMB footprint while D4 D5 and D6 are SMC footprints In addition there are also some capacitor footprints that can be populated if need be such as C4 or C11 8 Soldering Down U2 The HSS MOTHERBOARDEVM allows the user to solder down a device directly to the board without going th...

Page 12: ...1 0KL Yageo America R2 R7 R11 R12 R13 R14 R15 7 10k RES 10 k 5 0 1 W 0603 0603 RC1608J103CS Samsung Electro Mechanics R6 1 4 7k RES 4 7 k 5 0 1 W AEC Q200 Grade 0 0603 0603 CRCW06034K7 0JNEA Vishay Dale R16 R17 2 10k RES 10 k 5 0 1 W AEC Q200 Grade 0 0603 0603 CRCW060310K 0JNEA Vishay Dale SH J1 SH J2 SH J3 SH J4 SH J5 SH J6 SH J7 SH J8 SH J9 SH J10 10 1x2 Shunt 100mil Gold plated Black Shunt SNT ...

Page 13: ... Mechanics R8 R9 0 0 RES 0 5 0 063 W AEC Q200 Grade 0 0402 0402 CRCW04020000 Z0ED Vishay Dale U1_S 0 40 V 8 mOhm Dual Channel Smart High Side Switch PWP0024L TSSOP 24 PWP0024L TPS2HB08DQP WPRQ1 Texas Instruments U2 U2_S 0 40 V 8 mOhm Dual Channel Smart High Side Switch PWP0024L TSSOP 24 PWP0024L TPS2HB08BQP WPRQ1 Texas Instruments U3_S U4_S U5_S 0 40 V 16 mOhm Dual Channel Smart High Side Switch T...

Page 14: ...y set forth above or credit User s account for such EVM TI s liability under this warranty shall be limited to EVMs that are returned during the warranty period to the address designated by TI and that are determined by TI not to conform to such warranty If TI elects to repair or replace such EVM TI shall have a reasonable time to repair such EVM or provide replacements Repaired EVMs shall be warr...

Page 15: ...the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated Antenna types not included in this list having a gain greater than the maximum gain indicated for that type are strictly prohibited for use with this device Concernant les EVMs avec antennes détachables Conformément à la réglementation d Industrie Canada le présent émetteur radio peut fo...

Page 16: ...ed loads Any loads applied outside of the specified output range may also result in unintended and or inaccurate operation and or possible permanent damage to the EVM and or interface electronics Please consult the EVM user guide prior to connecting any load to the EVM output If there is uncertainty as to the load specification please contact a TI field representative During normal operation even ...

Page 17: ...COST OF REMOVAL OR REINSTALLATION ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES RETESTING OUTSIDE COMPUTER TIME LABOR COSTS LOSS OF GOODWILL LOSS OF PROFITS LOSS OF SAVINGS LOSS OF USE LOSS OF DATA OR BUSINESS INTERRUPTION NO CLAIM SUIT OR ACTION SHALL BE BROUGHT AGAINST TI MORE THAN TWELVE 12 MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS OCCURRED 8 2 Specif...

Page 18: ...se resources are subject to change without notice TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource Other reproduction and display of these resources is prohibited No license is granted to any other TI intellectual property right or to any third party intellectual property right TI disclaims responsibility for...

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