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8.9 Hardware Schematic
MIRROR_EN
FID1
CMP-0077181-1
FID3
CMP-0077181-1
FID5
CMP-0077181-1
LOGO
PCB
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LOGO
PCB
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LOGO
PCB
WEEE logo
1
M1
1
M2
1
M3
1
M4
H1
1902C
H2
1902C
H3
1902C
H4
1902C
1
M5
1
M6
H5
1902C
H6
1902C
GND
GND
GND
GND
GND
GND
FID2
CMP-0077181-1
FID4
CMP-0077181-1
FID8
CMP-0077181-1
1
M7
1
M8
H7
1902C
H8
1902C
GND
RJ45_ERTH
FID6
CMP-0077181-1
FID7
CMP-0077181-1
FID9
CMP-0077181-1
FID10
CMP-0077181-1
FID11
CMP-0077181-1
FID12
CMP-0077181-1
FID13
CMP-0077181-1
FID14
CMP-0077181-1
FID15
CMP-0077181-1
FID16
CMP-0077181-1
FID17
CMP-0077181-1
FID18
CMP-0077181-1
SH-J1
M7582-05
SH-J2
M7582-05
SH-J3
M7582-05
SH-J4
M7582-05
SH-J5
M7582-05
SH-J6
M7582-05
SH-J7
M7582-05
SH-J8
M7582-05
Assembly Note
ZZ1
These assemblies are ESD sensitive, ESD precautions shall be observed.
Assembly Note
ZZ2
These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable.
Assembly Note
ZZ3
These assemblies must comply with workmanship standards IPC-A-610 Class 2, unless otherwise specified.
Figure 8-9. DP83561EVM Hardware
Schematics
SLVUC11 – APRIL 2021
DP83561EVM User’s Guide
31
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