Texas Instruments C2000 F28003x Series User Manual Download Page 14

3.1.11.3 Alternate Power

Additional jumpers are provided outside of the BoosterPack connector for additional external power connections 
for 3.3 V or 5 V. These can be used to supply an external board or for powering the LaunchPad with an external 
supply. When using these connection points, ensure that no other power supplies are connected.

JP4 and JP6

 are provided as extra connection points for a 3.3 V supply to be connected to the LaunchPad.

JP5 and JP7

 are provided as extra connection points for a 5 V supply to be connected to the LaunchPad.

3.2 Debug Interface

3.2.1 XDS110 Debug Probe

The F28003x LaunchPad includes an on-board XDS110 Debug Probe. The XDS110 allows for the programming 
and debugging of the F280039C using 

Code Composer Studio (CCS)

, or any other supported tool chains. In the 

default configuration, the XDS110 is only wired to support 2-pin cJTAG mode. This uses only the TMS and TCK 
JTAG pins and allows the TDI and TDO pins of the F28003x device to be reallocated for otherapplication needs. 
TDI and TDO are available on GPIO35 and GPIO37. These pins are not routed to the debug probe by default, 
but can be connected by populating resistors R44 and R45.

3.2.2 XDS110 Output

The connector J102 is provided to debug an external target with the on-board XDS110 debug probe. This 
connector allows the LaunchPad to be used as a stand-alone XDS110 debug probe. For mating connector and 
cable see 

Samtec FFSD

 or equivalent.

If the LaunchPad is being used in this manner, ensure that all of the jumpers are removed from J101. This 
isolates the JTAG signals from going to the F280039C MCU. UART TX and RX signals from the XDS110 device 
are also included on this connector.

3.2.3 Virtual COM Port

When plugged into a USB host, the XDS110 enumerates as both a debugger and a virtual COM port. J101 
allows the user to connect the SCI UART from the F280039C to the debug probe to be passed on to the USB 
host. By default the F28003x SCIA maps to the virtual COM port of the XDS110 using GPIO28 and GPIO29. 
Alternately, GPIO15 and GPIO56 can be used for SCIB. This is accomplished by manipulating the on-board 
switch S2. For the appropriate switch settings, see 

Section 3.3.2

.

3.3 Alternate Routing

3.3.1 Overview

The F280039C MCU is a very versatile device in a mid-size package. To balance compatibility with BoosterPack 
standards, as well as showcasing the versatility of the F280039C, some complexity was added to the design. 
Most features aligning with the BoosterPack standard are available by default. The additional functions are 
configured using switches or static resistors which can be added or removed. This section covers the alternate 
functions and how to enable them. Note that by enabling certain alternate features, standard BoosterPack 
functionality may be lost. The switches and resistors are configured such that it is not possible to connect 
multiple functions to the same header.

3.3.2 UART Routing

This LaunchPad allows for one of two sets of pins to be used for the SCIA UART routed to the virtual COM port 
of the XDS110. By default, GPIO28 (SCIA_RX) and GPIO29 (SCIA_TX) are routed to the virtual COM port and 
not available on the BoosterPack connector. Alternately, GPIO15 (SCIB_RX) and GPIO56 (SCIB_TX) can be 
routed to the virtual COM port. When UART functionality is not needed at the virtual COM port, the GPIOs can 
be routed to the BoosterPack connectors for BoosterPack standard functions.

Hardware Description

www.ti.com

14

C2000

 F28003x Series LaunchPad

 Development Kit

SPRUJ31 – APRIL 2022

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Copyright © 2022 Texas Instruments Incorporated

Summary of Contents for C2000 F28003x Series

Page 1: ...memory The LaunchPad also features two independent BoosterPack XL expansion connectors 80 pins on board Controller Area Network CAN transceiver supporting both standard CAN DCAN and CAN FD MCAN two 5...

Page 2: ...Figure 3 1 F28003x LaunchPad Development Kit Block Diagram 9 Figure 3 2 LaunchPad Power Distribution Diagram 10 Figure 3 3 LaunchPad Power Plane Diagram 11 Figure 4 1 Top Signal Layer 1 17 Figure 4 2...

Page 3: ...maximize expansion through the BoosterPack ecosystem 1 3 Specifications Table 1 1 summarizes the F28003x LaunchPad specifications Table 1 1 LAUNCHXL F280039C Specifications Parameter Value Board Supp...

Page 4: ...rve as a starting point for such projects 5 Get Trained Review and download hours of written and video training materials on C2000 Real time Microcontrollers and related LaunchPads a See Getting Start...

Page 5: ...EVM are listed below Known issues No issues to report at this time of initial release Special notes and considerations to be aware of Nothing to report at this time of initial release 2 Software Deve...

Page 6: ...d with the LaunchPad To do this in Windows open the Device Manager Look for an entry under Ports COM and LPT titled XDS110 Class Application User UART COMX where X is a number Remember this number for...

Page 7: ...e on board XDS110 is used with the On Chip Flash Programmer tool to program applications to the F28003x LaunchPad Follow these steps to program example applications onto the F28003x LaunchPad developm...

Page 8: ...efine NAME 8 Right click the project name and select Rebuild Project in CCS 9 Launch the LAUNCHXL F280039C Target Configuration file and connect to the F28003x device Ensure that the Target Configurat...

Page 9: ...SB ESD Device Boot Mode switch GPIO 24 32 2x10 pin BP Header FSI 2x5 Header Reset Button CAN Header Crystal Oscillator LED Driver eQEP 3 3 V 5 V Level Shifters eQEP Headers 2x10 pin BP Header 2x10 pin...

Page 10: ...is factory programmed with a quick start demo program The quick start program resides in the on chip Flash memory and executes each time power is applied unless the application has been replaced with...

Page 11: ...0 Connects the 5 V power on the XDS110 side of the board 5V0_XDS110 to the 5 V power on the F280039C side of the board 5V0_MCU JP2 3V3 Connects the 3 3 V power on the XDS110 side of the board 3V3_XDS1...

Page 12: ...4 through the on board CAN Transceiver Both standard CAN and CAN FD Mux options exist on these F28003x device pins Switch S4 is used to route GPIO4 and GPIO5 to either the CAN transceiver and connecto...

Page 13: ...e reference For best performance some additional circuitry may be required 3 1 11 Other Headers and Jumpers The LaunchPad has multiple jumpers to select different power sources for the board This Laun...

Page 14: ...Virtual COM Port When plugged into a USB host the XDS110 enumerates as both a debugger and a virtual COM port J101 allows the user to connect the SCI UART from the F280039C to the debug probe to be pa...

Page 15: ...ransceiver If S4 is set to UP off the GPIOs are routed to the BoosterPack connectors default case 3 3 5 FSI Routing One set of GPIOs with available FSI functionality are directly connected to the FSI...

Page 16: ...Digital to Analog Converter on a TMS320F280x Digital Signal Control By default the RC filter is not populated Instead a0 ohm resistor is populated and the capacitor is left un populated 4 Board Design...

Page 17: ...Figure 4 1 Top Signal Layer 1 www ti com Board Design SPRUJ31 APRIL 2022 Submit Document Feedback C2000 F28003x Series LaunchPad Development Kit 17 Copyright 2022 Texas Instruments Incorporated...

Page 18: ...Figure 4 2 GND Layer 2 Board Design www ti com 18 C2000 F28003x Series LaunchPad Development Kit SPRUJ31 APRIL 2022 Submit Document Feedback Copyright 2022 Texas Instruments Incorporated...

Page 19: ...Figure 4 3 PWR Layer 3 www ti com Board Design SPRUJ31 APRIL 2022 Submit Document Feedback C2000 F28003x Series LaunchPad Development Kit 19 Copyright 2022 Texas Instruments Incorporated...

Page 20: ...for the LAUNCHXL F280039C is included in the LAUNCHXL F280039C design files download Board Design www ti com 20 C2000 F28003x Series LaunchPad Development Kit SPRUJ31 APRIL 2022 Submit Document Feedba...

Page 21: ...the location of selected features of the board as well as the component locations Figure 4 5 F28003x LaunchPad Dimensions and Component Locations www ti com Board Design SPRUJ31 APRIL 2022 Submit Doc...

Page 22: ...the board Ensure that 3 3 V is supplied to any of the available connectors on the target side of the isolation c Is the USB C cable connected to the PCB and is the USB region receiving power Is LED7...

Page 23: ...e of two possible UART channels to be routed to the debug probe through J101 Ensure that S2 is configured to the appropriate UART channel for the application software For details see Section 3 3 2 6 R...

Page 24: ...ain Output TPD4E004 4 Channel ESD Protection Array for High Speed Data Interfaces TPD4E05U06 4 Channel ESD Protection Array for for USB HDMI High Speed Interfaces TPS3702 High Accuracy Fixed Threshold...

Page 25: ...ther than TI b the nonconformity resulted from User s design specifications or instructions for such EVMs or improper system design or c User has not paid on time Testing and other quality control tec...

Page 26: ...These limits are designed to provide reasonable protection against harmful interference in a residential installation This equipment generates uses and can radiate radio frequency energy and if not in...

Page 27: ...instructions set forth by Radio Law of Japan which includes but is not limited to the instructions below with respect to EVMs which for the avoidance of doubt are stated strictly for convenience and s...

Page 28: ...any interfaces electronic and or mechanical between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electr...

Page 29: ...R DAMAGES ARE CLAIMED THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT 9 Return Policy Except as otherwise provided TI does not offer any refunds returns or exchanges Furthe...

Page 30: ...change without notice TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource Other reproduction and display of thes...

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