Telit Wireless Solutions HE910-EU V2 Hardware User'S Manual Download Page 71

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Telit_SIM_Integration_Design_Guide_Application_Note

Summary of Contents for HE910-EU V2

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Page 3: ...ing the exclusive right to copy reproduce in any form distribute and make derivative works of the copyrighted material Accordingly any copyrighted material of Telit and its licensors contained herein or in the Telit products described in this instruction manual may not be copied reproduced distributed merged or modified in any manner without the express written permission of Telit Furthermore the ...

Page 4: ...or written permission of Telit High Risk Materials Components units or third party products used in the product described herein are NOT fault tolerant and are NOT designed manufactured or intended for use as on line control equipment in the following hazardous environments requiring fail safe controls the operation of Nuclear Facilities Aircraft Navigation or Aircraft Communication Systems Air Tr...

Page 5: ...Contents 4 2 2 Hardware Shutdown ...

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Page 9: ...ct technical support to report documentation errors and to order manuals contact Telit Technical Support Center TTSC at TS EMEA telit com TS NORTHAMERICA telit com TS LATINAMERICA telit com TS APAC telit com Alternatively use http www telit com en products technical support center contact php For detailed information about where to buy the Telit modules or for recommendations on accessories and co...

Page 10: ...rts Refers to the serial ports of the Telit HE910 V2 Chapter 9 Audio Section overview Refers to the audio blocks of the Base Band Chip of the HE910 V2 Telit Module Chapter 10 General Purpose I O How the general purpose I O pads can be configured Chapter 11 DAC and ADC section Deals with these two kinds of converters Chapter 12 Mounting the Module on the application board Mechanical dimensions and ...

Page 11: ...dule and end user equipment may fail or malfunction Tip or Information Provides advice and suggestions that may be useful when integrating the module All dates are in ISO 8601 format i e YYYY MM DD HE910 V2 Product Description 80418ST10602A HE910 V2 Software User guide 1vv0301071 HE910 V2 AT command reference guide 80428ST10592A HE910 V2 Digital Voice Interface Application Note 80000NT10101A Telit...

Page 12: ...s must not be considered mandatory instead the information given must be used as a guide and a starting point for properly developing your product with the Telit HE10 V2 module NOTE The integration of the GSM GPRS EGPRS WCDMA HSPA HE910 V2 cellular module within user application must be done according to the design rules described in this manual The information presented in this document is believ...

Page 13: ...ta Voice GPS EMEA APAC Latin American markets HE910 EU V2 5 76 14 4 900 2100 HE910 EUG V2 5 76 14 4 900 2100 North American markets HE910 NA V2 5 76 14 4 850 1900 HE910 NAG V2 5 76 14 4 850 1900 The Telit HE910 V2 module overall dimensions are Length 28 2 mm Width 28 2 mm Thickness 2 2 mm The module weight of HE910 V2 is about 4 0 gram ...

Page 14: ...age and non operating Temperature Range 40 C 90 C As a part of Telit s corporate policy of environmental protection the HE910 V2 complies with the RoHS Restriction of Hazardous Substances directive of the European Union EU directive 2011 65 EU ...

Page 15: ...4 8 975 1023 45 MHz DCS1800 1710 2 1784 8 1805 2 1879 8 512 885 95MHz PCS1900 1850 2 1909 8 1930 2 1989 8 512 810 80MHz WCDMA850 HE910 NA NAG V2 only 826 4 846 6 871 4 891 6 Tx 4132 4233 Rx 4357 4458 45MHz WCDMA900 HE910 EU EUG V2 only 882 4 912 6 927 4 957 6 Tx 2712 2863 Rx 2937 3088 45MHz WCDMA1900 HE910 NA NAG V2 only 1852 4 1907 6 1932 4 1987 6 Tx 9262 9538 Rx 9662 9938 80MHz WCDMA2100 HE910 E...

Page 16: ...a to DTE CMOS 1 8V E15 RX_AUX I Auxillary UART RX Data from DTE CMOS 1 8V RUIM Card Interface A3 SIMVCC External SIM signal Power supply for the SIM 1 8 2 85V A4 SIMIN I External SIM signal Presence active low CMOS 1 8V A5 SIMIO I O External SIM signal Data I O 1 8 2 85V A6 SIMCLK O External SIM signal Clock 1 8 2 85V A7 SIMRST O External SIM signal Reset 1 8 2 85V Digital Voice interface DVI B9 D...

Page 17: ...ries Power ON Monitor 1 8V Power Supply M1 VBATT Main Power Supply Baseband Power M2 VBATT Main Power Supply Baseband Power N1 VBATT_PA Main Power Supply PAM Power N2 VBATT_PA Main Power Supply PAM Power P1 VBATT_PA Main Power Supply PAM Power P2 VBATT_PA Main Power Supply PAM Power E1 GND Ground G1 GND Ground H1 GND Ground J1 GND Ground L1 GND Ground A2 GND Ground E2 GND Ground F2 GND Ground G2 G...

Page 18: ...Reserved Reserved F1 Reserved Reserved F3 Reserved Reserved G3 Reserved Reserved H3 Reserved Reserved J3 Reserved Reserved K3 Reserved Reserved L3 Reserved Reserved B4 Reserved Reserved C4 Reserved Reserved B5 Reserved Reserved C5 Reserved Reserved C6 Reserved Reserved C7 Reserved Reserved N7 Reserved Reserved P7 Reserved Reserved A8 Reserved Reserved N8 Reserved Reserved A9 Reserved Reserved N9 R...

Page 19: ... Reserved Reserved N13 Reserved Reserved A14 Reserved Reserved D14 Reserved Reserved F14 Reserved Reserved G14 Reserved Reserved H14 Reserved Reserved J14 Reserved Reserved K14 Reserved Reserved F15 Reserved Reserved H15 Reserved Reserved J15 Reserved Reserved WARNING Reserved pins must not be connected NOTE The following table is listing the main Pinout differences between the HE910 V2 variants P...

Page 20: ... Point A13 VBUS If not used should be connected to a Test Point N15 C103 TXD If not used should be connected to a Test Point M15 C104 RXD If not used should be connected to a Test Point L14 C105 RTS If the flow control is not used it should be connected to GND P15 C106 CTS If not used should be connected to a Test Point D15 TXD_AUX If not used should be connected to a Test Point E15 RXD_AUX If not...

Page 21: ...NOTE The pin defined as RES must be considered RESERVED and not connected on any pin in the application The related area on the application has to be kept empty ...

Page 22: ...NOTE The pin defined as RES must be considered RESERVED and not connected on any pin in the application The related area on the application has to be kept empty ...

Page 23: ...g on HE910 V2 module the HE910 V2 module is not active yet because the boot sequence of HE910 V2 is still executing internally It takes about 10 seconds to complete the initialization of the module internally For this reason it would be useless to try to access HE910 V2 during the Initialization state as below The HE910 V2 module needs at least 10 seconds after the PWRMON goes High to become opera...

Page 24: ...blems on the HE910 V2 power regulator and improper power on off of the module The line ON_OFF must be connected only in open collector configuration NOTE In this document all the lines are inverted Active low signals are labeled with a name that ends with or with a bar over the name NOTE In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied ...

Page 25: ...n the device is shut down by software command or by hardware shutdown it issues a detach request to the network that informs the network that the device will no longer be reachable NOTE In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the HE910 V2 when the module is powered OFF or during an ON OFF transition ...

Page 26: ...E910 V2 goes into the finalization state and will shut down PWRMON at the end of this state The period of the finalization state can vary according to the state of the HE910 V2 so it cannot be fixed definitely Normally it will be above 10 seconds after sending a shutdown command and DTE should monitor the status of PWRMON to see the actual power off ...

Page 27: ...the hold time of ON_OFF is above 2 seconds the HE910 V2 goes into the finalization state and will shut down PWRMON at the end of this state The period of the finalization state can vary according to the state of the HE910 V2 so it cannot be fixed definitely Normally it will be above 10 seconds after releasing ON_OFF and DTE should monitor the status of PWRMON to see the actual power off TIP To che...

Page 28: ... milliseconds and then released A simple circuit to unconditionally shutdown the module is illustrated below NOTE Do not use any pull up resistor on the HW_SHUTDOWN line or any totem pole digital output Using a pull up resistor may bring latch up problems on the HE910 V2 power regulator and result in improper functioning of the module The line HW_SHUTDOWN must be connected only in open collector c...

Page 29: ...For example To drive the HW_SHUTDOWN pad with a totem pole output of a 3 5 V microcontroller uP_OUT2 The chart below describes the overall sequences for turning the module ON and OFF ...

Page 30: ...ss AT CFUN 1 WCDMA 15 Normal mode full functionality of the module GSM 15 AT CFUN 4 WCDMA 13 Disabled TX and RX modules is not registered on the network GSM 13 AT CFUN 0 or AT CFUN 5 WCDMA 3 2 512frame 1 0 64frame 2 Power saving CFUN 0 module registered on the network and can receive voice call or an SMS but it is not possible to send AT commands module wakes up with an unsolicited code call or SM...

Page 31: ...or in the extended operating voltage range might deviate from 3GPP3 specification NOTE The electrical design for the Power supply must be made ensuring that it will be capable of a peak current output of at least 2A In GSM GPRS mode RF transmission is not continuous and it is packed into bursts at a base frequency of about 216 Hz and the relative current peaks can be as high as about 2A Therefore ...

Page 32: ...ween the input source and the desired output so a linear regulator can be used A switching power supply will not be suitable because of the low drop out requirements When using a linear regulator a proper heat sink must be provided in order to dissipate the power generated A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current absorption peaks close to the HE9...

Page 33: ...o the current peaks absorption In any case the frequency and Switching design selection is related to the application to be developed due to the fact the switching frequency could also generate EMC interferences For car PB battery the input voltage can rise up to 15 8V and this must be kept in mind when choosing components all components in the power supply must withstand this voltage A Bypass low...

Page 34: ...The three battery cells Ni Cd or Ni MH 3 6V nom battery types or 4V PB types MUST NOT be used directly because their maximum voltage can rise over the absolute maximum voltage for the HE910 V2 and cause damage USE only Li Ion battery types NOTE Do not use any Ni Cd Ni MH and Pb battery types directly connected with HE910 V2 Their use can lead to overvoltage on HE910 V2 and damage it Use only Li Io...

Page 35: ...00mA class33 GPRS 390mA class10 GPRS rms plus 65mA rms for GPS in tracking mode Considering the very low current during idle especially if Power Saving function is enabled it is possible to consider from the thermal point of view that the device absorbs current significantly only during calls If we assume that the device stays in transmission for short periods of time let us say few minutes and th...

Page 36: ...se the power supply performances The Bypass low ESR capacitor must be placed close to the Telit HE910 V2 power input pads or in the case the power supply is a switching type it can be placed close to the inductor to cut the ripple if the PCB trace from the capacitor to HE910 V2 is wide enough to ensure a drop less connection even during the 2A current peaks The protection diode must be placed clos...

Page 37: ...d field noise at the switching frequency usually 100 500 kHz The use of a good common ground plane is suggested The placement of the power supply on the board must be done in a way to guarantee that the high current return paths in the ground plane are not overlapped to any noise sensitive circuitry as the microphone amplifier buffer or earphone amplifier The power supply input cables must be kept...

Page 38: ...ll fulfill the following requirements Antenna Line on PCB Requirements Characteristic Impedance 50Ohm Max Attenuation 0 3dB Coupling with other signals shall be avoided Cold End Ground Plane of antenna shall be equipotential to the HE910 V2 ground pads GSM WCDMA Antenna Requirements Frequency range Depending by frequency band s provided by the network operator the customer must use the most suitab...

Page 39: ...tics constant cross section avoid meanders and abrupt curves Any kind of suitable geometry structure can be used for implementing the printed transmission line afferent the antenna If a Ground plane is required in line geometry that plane has to be continuous and sufficiently extended so the geometry can be as similar as possible to the related canonical model Keep if possible at least one layer o...

Page 40: ...Antenna shall be installed also according Antenna manufacturer instructions The use of an active GPS GNSS antenna is required to achieve better performance The module is provided with a Digital Output signal to enable the external LNA pad R7 Parameter Min Max Output high level 1 35V 1 8V Output low level 0V 0 45V The use of combined RF GPS GNSS antenna is NOT recommended This solution could genera...

Page 41: ...PS or GNSS An external passive antenna GNSS pre Filter and GNSS LNA GPS or GNSS NOTE The external GNSS LNA and GNSS pre Filter shall be required for GLONASS application GNSS LNA requirement shall fulfill the following specifications Frequency 1565 1606MHz Power Gain S21 2 14 17dB NF 1dB GNSS pre Filter requirement shall fulfill the following requirements Source and Load Impedance 50Ohm Insertion L...

Page 42: ... or 5 0V NOTE The maximum DC voltage applicable to ANT_GPS pin is 5V In case this is exceeded a series capacitor has to be included in the design to avoid exceeding the maximum input DC level An example of GNSS antenna supply circuit is shown in the following image When using the Telit HE910 V2 since there s no antenna connector on the module the antenna must be connected to the HE910 V2 through t...

Page 43: ...nd around the antenna line on PCB has to be strictly connected to the main Ground plane by placing vias once per 2mm at least Place EM noisy devices as far as possible from HE910 V2 antenna line Keep the antenna line far away from the HE910 V2 power supply lines If EM noisy devices are around the PCB hosting the HE910 V2 such as fast switching ICs take care of shielding of antenna line by burying ...

Page 44: ...ial Data C15 USB_D I O USB differential Data A13 VBUS I Power sense for the internal USB transceiver 5V The USB_DPLUS and USB_DMINUS signals have a clock rate of 480MHz The signal traces should be routed carefully Trace lengths number of vias and capacitive loading should be minimized The impedance value should be as close as possible to 90 Ohms differential WARNING Consider a mechanical design an...

Page 45: ...tages different from 1 8V Depending on the type of serial port on the OEM hardware a level translator circuit may be needed to make the system work Serial port 1 is a 1 8V UART with all the 7 RS232 signals Serial port 2 is a 1 8V Auxiliary UART The electrical characteristics of the serial port are explained in the following tables Absolute Maximum Ratings Not Functional Parameter Min Max Input lev...

Page 46: ...mentation only the TXD and RXD lines must be connected the other lines can be left open provided a software flow control is implemented NOTE In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the HE910 V2 when the module is powered off or during an ON OFF transition NOTE According to V 24 RX TX signal names are refe...

Page 47: ... 1 8V NOTE In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the HE910 V2 when the module is powered off or during an ON OFF transition In order to interface the Telit HE910 V2 with a PC com port or a RS232 EIA TIA 232 application a level translator is required This level translator must Invert the electrical signa...

Page 48: ...By convention the driver is the level translator from the 0 1 8V UART to the RS232 level The receiver is the translator from the RS232 level to 0 1 8V UART In order to translate the whole set of control lines of the UART you will need 5 drivers 3 receivers An example of RS232 level adaption circuitry could be accomplished using a MAXIM transceiver MAX218 In this case the chipset is capable of tran...

Page 49: ...The RS232 serial port lines are usually connected to a DB9 connector with the following layout ...

Page 50: ...n For further information please refer to the Digital Voice Interface Application Note The product is providing one Digital Audio Interface DVI on the following Pins Pin Signal I O Function Type B9 DVI_WA0 I O Digital Voice interface WA0 1 8V B6 DVI_RX I Digital Voice interface RX B7 DVI_TX O Digital Voice interface TX B8 DVI_CLK I O Digital Voice interface CLK Please refer to the Digital Voice In...

Page 51: ...are and acts depending on the function implemented The following GPIOs are available on the HE910 V2 Pin Signal I O Function Drive Strength Type C8 GPIO_01 I O Configurable GPIO 2 mA 1 8V C9 GPIO_02 I O Configurable GPIO 2 mA 1 8V C10 GPIO_03 I O Configurable GPIO 2 mA 1 8V C11 GPIO_04 I O Configurable GPIO 2 mA 1 8V B14 GPIO_05 I O Configurable GPIO 2 mA 1 8V C12 GPIO_06 I O Configurable GPIO 2 m...

Page 52: ...s Absolute Maximum Ratings Not Functional Parameter Min Max Input level on any digital pin CMOS 1 8 with respect to ground 0 3V 2 3V Operating Range Interface levels 1 8V CMOS Parameter Min Max Input high level 1 5V 2 1V Input low level 0 0V 0 35V Output high level 1 35V 1 8V Output low level 0 0V 0 45V Current characteristics Parameter Typical Output Current 2mA Input Current 30uA ...

Page 53: ... from the 1 8V CMOS It can be buffered with an open collector transistor with a 4 7KΩ pull up resistor to 1 8V NOTE In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the module when it is powered OFF or during an ON OFF transition The GPIO pads when used as outputs can drive 1 8V CMOS digital devices or compatible ...

Page 54: ...the HE910 V2 modules the STAT_LED usually needs an external transistor to drive an external LED Because of the above the status indicated in the following table is reversed with respect to the pin status Device Status LED status Device off Permanently off Not registered Permanently on Registered in idle Blinking 1 sec on 2 sec off Registered in idle power saving It depends on the event that trigge...

Page 55: ...ring power off of the battery NOTE NO devices must be powered from this pin A regulated power supply output is provided in order to supply small devices from the module This output is active when the module is ON and goes OFF when the module is shut down The operating range characteristics of the supply are Operating Range VAUX PWRMON power supply Parameter Min Typical Max Output voltage 1 77V 1 8...

Page 56: ...e is 2V the integrated voltage could be calculated with the following formula Integrated output voltage 2 value 1023 DAC_OUT line must be integrated for example with a low band pass filter in order to obtain an analog voltage An AT command is available to use the DAC function The command is AT DAC enable value value scale factor of the integrated output voltage 0 1023 10 bit precision it must be p...

Page 57: ...2 Volt AD conversion 8 bits Resolution 10 mV Input Resistance 1 Mohm The HE910 V2 provides one Analog to Digital Converter The input lines are ADC available on pin B1 and Pin 7 of PL102 on Interface Board CS1467D An AT command is available to use the ADC function The command is AT ADC 1 2 The read value is expressed in mV Refer to SW User Guide or AT Commands Reference Guide for the full descripti...

Page 58: ...The HE910 V2 has been designed in order to be compliant with a standard lead free SMT process Top view Bottom view Dimensions in mm ...

Page 59: ...inhibit area around the module on the application It is also suggested as a common rule for an SMT component to avoid having a mechanical part of the application in direct contact with the module NOTE In the customer application the region under WIRING INHIBIT see figure must be clear from signal or ground paths ...

Page 60: ...Stencil s apertures layout can be the same as the recommended footprint 1 1 we suggest a thickness of stencil foil 120 µm Non solder mask defined NSMD type is recommended for the solder pads on the PCB ...

Page 61: ...The recommendation for the PCB pads dimensions are described in the following image dimensions in mm ...

Page 62: ...mmersion Au 3 7 0 05 0 15 good solder ability protection high shear force values The PCB must be able to resist the higher temperatures which are occurring at the lead free process This issue should be discussed with the PCB supplier Generally the wettability of tin lead solder paste on the described surface plating is better compared to lead free solder paste It is not necessary to panel the appl...

Page 63: ...Lead free Solder Paste Sn Ag Cu We recommend using only no clean solder paste in order to avoid the cleaning of the modules after assembly Recommended solder reflow profile ...

Page 64: ...p Rate 3 second max Time maintained above Temperature TL Time tL 217 60 150 seconds Peak Temperature Tp 245 0 5 Time within 5 of actual Peak Temperature tp 10 30 seconds Ramp down Rate 6 sec max Time 25 to Peak Temperature 8 minutes max NOTE All temperatures refer to topside of the package measured on the package body surface WARNING The HE910 V2 module withstands one reflow process only ...

Page 65: ...The HE910 V2 modules are packaged on trays of 20 pieces each These trays can be used in SMT processes for pick place handling WARNING These trays can withstand a maximum temperature of 65 ...

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Page 67: ... sealed bag 12 months at 40 C and 90 relative humidity RH b Environmental condition during the production 30 C 60 RH according to IPC JEDEC J STD 033A paragraph 5 c The maximum time between the opening of the sealed bag and the reflow process must be 168 hours if condition b IPC JEDEC J STD 033A paragraph 5 2 is respected d Baking is required if conditions b or c are not respected e Baking is requ...

Page 68: ...ction between the HE910 V2 itself and the application and to test the performance of the module connecting it with an external computer Depending on the customer application these pads include but are not limited to the following signals TXD RXD ON_OFF HW_SHUTDOWN GND VBATT and VBATT_PA TX_AUX RX_AUX VAUX PWRMON VBUS USB_D USB_D ...

Page 69: ...ication board The length and width of the power lines need to be considered carefully and the capacitance of the capacitors needs to be selected accordingly The capacitor will also avoid the ripple of the power supplies and the switching noise caused in TDMA system like GSM Especially the suitable bypass capacitor must be mounted on the VBATT and VBATT_PA lines in the application board The recomme...

Page 70: ...ulled up to SIMVCC should be defined accordingly in order to be compliant to 3GPP specification For HE910 EUG V2 NAG V2 EU V2 NA V2 contain an internal pull up resistor on SIMIO However the un mounted option in application design can be recommended in order to tune R1 if necessary The following Table lists the values of C1 to be adopted with the HE910 V2 product Product P N C1 range nF HE910 EUG N...

Page 71: ... Telit_SIM_Integration_Design_Guide_Application_Note ...

Page 72: ...SB interfaces to communicate HE910 V2 Must implement a download method in a host system for upgrading HE910 V2 when it s mounted Users who use USB interface only to communicate HE910 V2 Must arrange UART port in a host system for debugging or upgrading HE910 V2 when it s mounted Users who use UART interface only to communicate HE910 V2 Must arrange USB port in a host system for debugging or upgrad...

Page 73: ...ollowing standards RF spectrum use R TTE art 3 2 EN 300 440 2 V1 4 1 EN 301 511 V9 0 2 EN 301 908 1 V5 2 1 EN 301 908 2 V5 2 1 EMC R TTE art 3 1b EN 301 489 1 V1 9 2 EN 301 489 3 V1 4 1 EN 301 489 7 V1 3 1 EN 301 489 24 V1 5 1 Health Safety R TTE art 3 1a EN 60950 1 2006 A11 2009 A1 2010 A12 2011 AC 2011 The HE910 EU V2 module is compliant with the following standards RF spectrum use R TTE art 3 2...

Page 74: ... countries of the European Union Final product integrating this module must be assessed against essential requirements of the 1999 5 EC R TTE Directive It should be noted that assessment does not necessarily lead to testing Telit Communications S p A recommends carrying out the following assessments RF spectrum use R TTE art 3 2 It will depend on the antenna used on the final product EMC R TTE art...

Page 75: ...ire de brouillage et 2 l utilisateur de l appareil doit accepter tout brouillage radioélectrique subi même si le brouillage est susceptible d en compromettre le fonctionnement Wireless notice This equipment complies with FCC and IC radiation exposure limits set forth for an uncontrolled environment The antenna should be installed and operated with minimum distance of 20 cm between the radiator and...

Page 76: ...ng the equipment off and on the user is encouraged to try to correct the interference by one or more of the following measures Reorient or relocate the receiving antenna Increase the separation between the equipment and receiver Connect the equipment into an outlet on a circuit different from that to which the receiver is connected Consult the dealer or an experienced radio TV technician for help ...

Page 77: ...ove the SIM when the product is in power saving mode The system integrator is responsible of the functioning of the final product therefore care has to be taken to the external components of the module as well as of any project or installation issue because the risk of disturbing the GSM network or external devices or having impact on the security Should there be any doubt please refer to the tech...

Page 78: ...rements Updated 8 1 Modem Serial Port 1 Updated 10 5 Indication of Network Service Availability Updated 14 3 SIM Interface Updated 15 Conformity Assessment Issues 2 2013 11 27 Updated 2 5 Environmental requirements Updated 6 1 GSM WCDMA Antenna Requirements Updated 15 2 FCC IC Regulatory notices ...

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