Tektronix WFM8200, Service Manual

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General Maintenance
Table 4-2: Internal inspection checklist (cont.)
Item Inspect for Repair action
Solder connections Cold solder or rosin joints. Resolder joint and clean
with isopropyl alcohol.
Capacitors
Damaged or leaking cases.
Corroded solder on leads or
terminals. Remove and replace
damaged circuit board.
Wiring and cables Loose plugs or connectors.
Burned, broken, or frayed
wiring. Firmly seat connectors.
Repair or replace modules
with defective wires or
cables.
Chassis Dents, deformations, and
damaged hardware. Straighten, repair, or replace
defective hardware.
Cleaning Procedure – Interior. To clean the instrument interior, perform the
following steps:
1. Blow off dust with dry, low-pressure, deionized air (approximately 9 psi).
2. Remove any remaining dust with a lint-free cloth dampened in isopropyl
alcohol (75% solution) and rinse with warm deionized water. (A cotton-tipped
applicator is useful for cleaning in narrow spaces and on circuit boards.)
STOP. If, after doing steps 1 and 2 , a module is clean upon inspection, skip
the remaining steps.
3. If steps 1 and 2 do not remove all the dust or dirt, the instrument may be spray
washed using a solution of 75% isopropyl alcohol by doing steps 4 through 6.
4. Gain access to the parts to be cleaned by removing easily accessible shields
and panels.
5. Spray wash dirty parts with the isopropyl alcohol and wait 60 seconds for the
majority of the alcohol to evaporate.
6. Dry all parts with low-pressure, deionized air.
Lubrication.
There is no periodic lubrication required for the instrument.
4–4 WFM8200 and WFM8300 Waveform Monitors Service Manual