Reference
Table 3: Via and trace characteristics
Parameter
Size
Via hole
10 mil
Via annular ring
20 mil
Via antipad
33 mil
Minimum space between via annular ring
and pad
5 mil
Trace width
14 mil
Microtrace width
5 mil
Space between traces (before and after
footprint negotiation)
14 mil
Space between microtraces (before and after
footprint negotiation)
5 mil
Primary Surface Layer Routing.
The following
fi
gure shows recommended trace
routing on the primary surface layer (the surface where the midbus footprint will
be). The solid white pads shown in the diagram are the ground pads.
Figure 22: Recommended trace routing on primary surface layer
Tektronix recommends that you design your footprint so that there are no traces
or vias in the two spaces designated in the following diagram. If your design
requires the use of these two spaces, Tektronix recommends that you fully solder
mask these areas.
26
P6700 Series Serial Analyzer Probes Instruction Manual
Summary of Contents for P6700 Series
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Page 81: ...Specifications 64 P6700 Series Serial Analyzer Probes Instruction Manual...
Page 87: ...Maintenance 70 P6700 Series Serial Analyzer Probes Instruction Manual...
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