Tyco Electronics Corporation
300 Constitutional Drive
Menlo Park, CA 94025 USA
No: RPIP-824-00
Rev: F
Date: April 28, 2006
Page: 9 of 11
© 2005-2006 Tyco Electronics Corporation. All rights reserved.
Unless otherwise specified dimensions are in millimeters [Inches dimensions are in between brackets]
If this document is printed it becomes uncontrolled. Check for the latest revision.
2.
Heating: The solder ring shape should not be visible and a solder fillet, at least 4.5 [0.180]
long, should be visible on one side of the leads. Fillet length should 8.0 [0.315] for larger
wires. Lack of a solder fillet may indicate overheating.
3.
Damage: The sleeve should not be split or cut and no wire strands should poke through the
sleeve.
Unacceptable
: Insufficient heat.
Contour of solder preform is visible.
Contour of terminal and/or lead is obscured by solder.
Acceptable:
Fillet is clearly visible between terminal and lead.
4.5
In-line Component Termination (CWT-200X and B-155-200X)
4.5.1 Wire
Preparation
1.
Remove 8.0 [0.315] of insulation from wires to be spliced.
8.0
(0.315)
