Tyco Electronics Corporation
300 Constitutional Drive
Menlo Park, CA 94025 USA
No: RPIP-824-00
Rev: F
Date: April 28, 2006
Page: 4 of 11
© 2005-2006 Tyco Electronics Corporation. All rights reserved.
Unless otherwise specified dimensions are in millimeters [Inches dimensions are in between brackets]
If this document is printed it becomes uncontrolled. Check for the latest revision.
Unacceptable:
Insufficient heat
.
Contour of solder perform is visible.
Acceptable:
Fillet is clearly visible between the lead and shield.
4.2
Wire to Wire (In-Line) Splices
4.2.1 Wire
Preparation
1. Wires from up to 18 AWG [1.5mm
2
] having 19 or fewer strands: Remove 9.5 [0.375] of
insulation from all wires to be spliced.
2. All other wires: Remove 12.5 [0.500] of insulation and pre-tin the exposed conductors
with
solder.
4.2.2 Assembly
1. Overlap the exposed conductors and position the one-step terminators so that the solder
preform is centered over the conductors.
