T3903
Page 8 of 21
Document Number: DS-000358
Revision: 1.0
SOLDERING PROFILE
Figure 2. Recommended Soldering Profile Limits
TABLE 7. RECOMMENDED SOLDERING PROFILE*
PROFILE FEATURE
Sn63/Pb37
Pb-Free
Average Ramp Rate (T
L
to T
P
)
1.25°C/sec max
1.25°C/sec max
Preheat
Minimum Temperature
(T
SMIN
)
100°C
100°C
Maximum Temperature
(T
SMAX
)
150°C
200°C
Time (T
SMIN
to T
SMAX
), t
S
60 sec to 75 sec
60 sec to 75 sec
Ramp-Up Rate (T
SMAX
to T
L
)
1.25°C/sec
1.25°C/sec
Time Maintained Above Liquidous (t
L
)
45 sec to 75 sec
~50 sec
Liquidous Temperature (T
L
)
183°C
217°C
Peak Temperature (T
P
)
215°C +3°C/−3°C
260°C +0°C/−5°C
Time 5°C of Actual Peak
Temperature (t
P
)
20 sec to 30 sec
20 sec to 30 sec
Ramp-Down Rate
3°C/sec max
3°C/sec max
Time +25°C (t
25°C
) to Peak Temperature
5 min max
5 min max
*The reflow profile in Table 7 is recommended for board manufacturing with TDK MEMS microphones. All microphones are also
compatible with the J-STD-020 profile
t
P
t
L
t
25°C
TO PEAK TEMPERATURE
t
S
PREHEAT
CRITICAL ZONE
T
L
TO T
P
TEMPER
AT
URE
TIME
RAMP-DOWN
RAMP-UP
T
SMIN
T
SMAX
T
P
T
L
