L2E Repair Document
TCL
Communication Ltd.
Rev.
VF1300 Level 2E Repair Document
Page
1.0
31/39
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7.2 Trouble shooting for common failures
1) Because the main PCBA will become damp after long time storage, please use oven to bake the main
PCBA firstly if it has been stored for more than 7days (oven temperature: 105
℃
, Time: >8H). Otherwise
it may cause the PCBA blister easily when you heat part of the PCBA by using hot wind gun.
2) Interchange method means using a new component to test the function in order to verify whether the
old component is defected.
3) Please use hot air gun to re-weld or disassemble/assemble the component mentioned afterwards. (hot
air gun temperature: 330
℃
, Air Level: 2~3, Height: around 10mm, Time: less than 60s)
4) Before re-welding or disassembling/assembling the component, DO remember to paste high
temperature adhesive tape on the components which are close to it, in order to avoid damaging of
these components.
Note: Please refer to page 29 to page 30 for position of components.
