TCL Alcatel Pixi4-7 TMO, Repair Document

Page: 3 / 62

L2E Repair Document
TCL
Communication Ltd.
Rev.
9015W Level 2 Enhance Repair Document
Page
1.0 3/62
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Content
1 Level 2 enhance repair process ............................................................................... 4
2 Warranty Check and Visual Inspection ................................................................... 5
2.1 Warranty confirmation of L1..................................................................................... 5
2.2 Visual mechanical check .......................................................................................... 6
2.3 Pretest ........................................................................................................................ 8
3 Software download ................................................................................................. 13
3.1 Equipments requested when download
：
............................................................ 13
3.2 SUGAR ..................................................................................................................... 14
SW download process ................................................................................................... 15
3.4 Multi-Download Tool ............................................................................................... 17
3.5 Kill Switch ................................................................................................................ 21
5 Disassembly and assembly 9015W ....................................................................... 24
5.1 ESD Safety ............................................................................................................... 24
5.2 Disassembly tool ..................................................................................................... 25
5.3 Disassembly process ............................................................................................. 25
5.4 Reassembly Process .............................................................................................. 35
5.5 Disassembly process evaluation ........................................................................... 35
6 Disassembly Complete ........................................................................................... 36
7 Level 2 repair ........................................................................................................... 37
8 L2 Enhance repair ................................................................................................... 43
8.1 Position of L2 enhance components on main PCBA ........................................... 43
8.2 Trouble shooting for common failures .................................................................. 45
8.3 L2 enhance spare part list ...................................................................................... 55
9 PCBA exchange ....................................................................................................... 55
10 Other component exchange ................................................................................... 56
11 Final test .................................................................................................................. 57
APPENDIX 1 Packaging Requirements ........................................................................ 58