L2E Repair Document
TCL
Communication Ltd.
Rev.
9015W Level 2 Enhance Repair Document
Page
1.0
45/62
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8.2 Trouble shooting for common failures
NOTE:
1) Because the main PCBA will become damp after long time storage, please use oven to bake the
main PCBA firstly if it has been stored for more than 7days (oven temperature: 105
℃
, Time: >8H).
Otherwise it may cause the PCBA blister easily when you heat part of the PCBA by using hot wind gun.
2) Interchange method means using a new component to test the function in order to verify whether
the old component is defected.
3) Please use hot wind gun to reweld or disassemble/assemble the component mentioned afterwards.
(hot wind gun temperature: 330
℃
, Air Level: 2~3, Height: around 10mm, Time:
less than 60s
)
4) Before rewelding or disassembling/assembling the component, DO remember to paste high
temperature adhesive tape on the components which are close to it, in order to avoid damaging of
these components.
8.2.1 Display failure
