IPC/CO MPACT6-XS: user documentation
DOC/COMPACT6-XSE; V1.3
© Syslogic Datentechnik AG, CH-5405 Baden-Daettwil, Switzerland, http://www.syslogic.ch
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6
Technical Data
6.1.
Electrical Data
Important Note
Do not operate the COMPACT6-XS system outside of the recommended operating conditions.
Otherwise lifetime and performance will degrade. Operating the board outside of the absolute
maximum ratings may damage the hardware.
Absolute Maximum Ratings (over free-air temperature range)
Parameter
Symbol
min
nom
max
Unit
IPC/COMPACT6-1F specific ratings
isolation CAN to chassis
(AC, 60s, 500m a.s.l., Ta=25°C)
1000
Vrms
Isolation CAN to logic
(AC, 60s, 500m a.s.l., Ta=25°C)
1500
Vrms
creepage distance CAN to logic
1.6
mm
creepage distance CAN to chassis
2.5
mm
IPC/COMPACT6-1G and IPC/COMPACT6L-1G specific ratings
isolation RS422/RS485 to chassis
(AC, 60s, 500m a.s.l., Ta=25°C)
1000
Vrms
Isolation RS422/RS485 to logic
(AC, 60s, 500m a.s.l., Ta=25°C)
1000
Vrms
creepage distance RS422/RS485 to logic
2.0
mm
creepage distance RS422/RS485 to chassis
1.0
mm
Non-specific ratings
internal power supply voltage
Vcc
-0.5
5.5 Vdc
isolation logic to chassis
(AC, 60s, 500m a.s.l., Ta=25°C)
500
Vrms
isolation RJ45 to logic (AC, 60s, 500m a.s.l.,
Ta=25°C)
1500
Vrms
isolation RJ45 to chassis (AC, 60s, 500m a.s.l.,
Ta=25°C)
1000
Vdc
creepage distances:
logic to chassis and PCB boarder
1.0
mm
logic to PC/104 mounting holes
0.5
mm
