3.3 Reflow Soldering
The Tile is designed to be reflow soldered onto a PCB. A recommended reflow profile can be
found below in
Figure 3
and
Table 5
Use of "No Clean" soldering paste is recommended. An example “No Clean” paste can be found
below:
Soldering Paste: M8 SAC305 / PN#89268 (AIM Solder)
Alloy specification: Sn 95.5/ Ag 4/ Cu 0.5 (96.5% Tin/ 3% Silver/ 0.5% Copper)
Melting Temperature: 217° C
Stencil Thickness: 100 to 150 µm for base boards
Figure 3:
Recommended reflow profile for lead-free solder paste.
June 2020
Swarm Tile Manual - Rev 1.00
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