DocID026079 Rev 3
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STM32F038x6
Package information
98
7.4 WLCSP25
package information
WLCSP25 is a 25-ball, 2.423 x 2.325 mm, 0.4 mm pitch wafer level chip scale package.
Figure 39. WLCSP25 package outline
1. Drawing is not to scale.
Table 63. WLCSP25 package mechanical data
Symbol
millimeters
inches
(1)
Min
Typ
Max
Min
Typ
Max
A
0.525
0.555
0.585
0.0207
0.0219
0.0230
A1
-
0.175
-
-
0.0069
-
A2
-
0.380
-
-
0.0150
-
A3
(2)
-
0.025
-
-
0.0010
-
b
(3)
(4)
0.220
0.250
0.280
0.0087
0.0098
0.0110
D
2.388
2.423
2.458
0.0940
0.0954
0.0968
E
2.29
2.325
2.36
0.0902
0.0915
0.0929
e
-
0.400
-
-
0.0157
-
e1
-
1.600
-
-
0.0630
-
e2
-
1.600
-
-
0.0630
-
F
-
0.4115
-
-
0.0162
-
G
-
0.3625
-
-
0.0143
-
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