ST STM32F4 Series, Application Note

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Package AN4488
20/50 AN4488 Rev 7
4 Package
4.1 Package Selection
Package should be selected by taking into account the constrains that are strongly
dependent upon the application.
The list below summarizes the more frequent ones:
– Amount of interfaces required.
Some interfaces might not be available on some packages.
Some interfaces combinations could not be possible on some packages.
– PCB technology constrains.
Small pitch and high ball density could require more PCB layers and higher class
PCB
– Package height
– PCB available area
– Noise emission or signal integrity of high speed interfaces.
Smaller packages usually provide better signal integrity. This is further enhanced
as Small pitch and high ball density requires multilayer PCBs which allow better
supply/ground distribution.
– Compatibility with other devices.
Table 3 summarizes the available packages for all STM32F4xxxx family.
Table 3. Package summary
Size (mm)
(1)
10
x
10
14
x
14
20
x
20
24
x
24
28
x
28
13
x
13
7 x
7
7 x
7
7 x
7
10
x
10
7 x
7
10
x
10
2.55
3 x
2
.5
79
3.03
4 x
3
.2
20
3.06
0 x
3
.0
60
3.65
8 x
3
.6
86
4.03
9 x
3
.9
51
5.69
3 x
3
.8
15
4.22
3 x
4
.2
23
4.52
1 x
5
.5
47
4.89
1 x
5
.6
92
Sales numbers
LQ
FP6
4
LQ
FP1
00
LQ
FP1
44
LQ
FP1
76
LQ
FP2
08
TFBGA2
16
UFQFPN48 UFBGA100 UFBGA144 UFBGA144 UFBGA169 UFBGA176
WLCSP36 WLCSP49 WLCSP49 WLCSP64 WLCSP81 WLCSP81 WLCSP90
WLCSP143 WLCSP168
STM32F401xB/C
STM32F401xD/E
X X X X X
STM32F405xx/407xx X X X X X X
STM32F410xx X X X
STM32F411xx X X X X X
STM32F412xx X X X X X X X
STM32F413xx/423xx X X X X X X X
STM32F415xx/417xx X X X X X X
STM32F427xx/429xx X X X X X X X X