2
XR-CA300/CA320/CA320X
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
TABLE OF CONTENTS
1.
GENERAL
Location of Controls .......................................................
3
Setting the Clock .............................................................
3
Installation .......................................................................
4
Connections .....................................................................
5
2.
DISASSEMBLY
2-1. Disassembly Flow ...........................................................
8
2-2. Sub Panel .........................................................................
8
2-3. Mechanism Deck (MG-36SZ11-32) ...............................
9
2-4. MAIN Board ...................................................................
9
2-5. Heat Sink ......................................................................... 10
2-6. Bracket (MD) .................................................................. 10
2-7. Motor (Capstan/Reel) (M901) ........................................ 11
2-8. Main Belt, Sub Belt (C) .................................................. 11
2-9. Head (Play Back) (HP901) ............................................. 12
3.
MECHANICAL ADJUSTMENTS
....................... 13
4.
ELECTRICAL ADJUSTMENTS
......................... 13
Tape Deck Section .......................................................... 14
Tuner Section .................................................................. 15
5.
DIAGRAMS
5-1. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 18
5-2. Printed Wiring Board – MAIN Board – ........................ 19
5-3. Schematic Diagram – MAIN Board (1/2) – .................. 20
5-4. Schematic Diagram – MAIN Board (2/2) – .................. 21
5-5. Printed Wiring Board – CONTROL Board – ................ 22
5-6. Schematic Diagram – CONTROL Board – ................... 23
5-7. IC Pin Function Description ........................................... 25
6.
EXPLODED VIEWS
6-1. General Section ............................................................... 27
6-2. Front Panel Section ......................................................... 28
6-3. Mechanism Deck Section (MG-36SZ11-32) ................. 29
7.
ELECTRICAL PARTS LIST
............................... 30
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