61
STR-DH550/DH750
SECTION 7
ELECTRICAL PARTS LIST
Note:
• Due to standardization, replacements in
the parts list may be different from the
parts speci
fi
ed in the diagrams or the com-
ponents used on the set.
• Items marked “
*
” are not stocked since
they are seldom required for routine ser-
vice.
Some delay should be anticipated when
ordering these items.
• RESISTORS
All resistors are in ohms.
METAL:
Metal-
fi
lm resistor.
METAL OXIDE: Metal oxide-
fi
lm resistor.
F:
non
fl
ammable
• CAPACITORS
uF:
μ
F
• COILS
uH:
μ
H
• SEMICONDUCTORS
In each case, u:
μ
, for example:
uA.
. :
μ
A. . , uPA. . ,
μ
PA. . ,
uPB.
.
:
μ
PB. . , uPC. . ,
μ
PC. . ,
uPD.
.
:
μ
PD. .
• Abbreviation
AUS :
Australian
model
BR :
Brazillian
model
CND :
Canadian
model
E12
: 220 – 240V AC area in E model
MX :
Mexican
model
TW :
Taiwan
model
When indicating parts by reference num-
ber, please include the board name.
The components identi
fi
ed by mark
0
or dotted line with mark
0
are critical for
safety.
Replace only with part number speci
fi
ed.
Les composants identi
fi
és par une marque
0
sont critiques pour la sécurité.
Ne les remplacer que par une pièce portant
le numéro spéci
fi
é.
DISPLAY
A-1989-480-A DISPLAY BOARD, COMPLETE (DH750)
A-1989-626-A DISPLAY BOARD, COMPLETE (DH550)
***********************
< CAPACITOR >
C112 1-116-734-11 CERAMIC
CHIP 1uF
20% 16V
C113 1-118-361-11 CERAMIC
CHIP 0.1uF
10% 50V
*
C114
1-116-723-11 CERAMIC CHIP 4.7uF
10%
10V
C115 1-118-291-11 CERAMIC
CHIP 100PF 5% 50V
C116 1-115-871-11 ELECT
1uF
20% 50V
C117 1-126-795-11 ELECT
10uF
20% 50V
C118 1-126-514-11 ELECT
22uF
20% 16V
C119 1-162-921-11 CERAMIC
CHIP 33PF
5% 50V
C120 1-126-514-11 ELECT
22uF
20% 16V
C121 1-162-921-11 CERAMIC
CHIP 33PF
5% 50V
C122 1-118-347-11 CERAMIC
CHIP 0.1uF
10% 25V
C123 1-115-871-11 ELECT
1uF
20% 50V
C124 1-126-382-11 ELECT
100uF 20% 16V
C125 1-162-966-91 CERAMIC
CHIP 0.0022uF 10% 50V
C127 1-119-943-91 ELECT
47uF
20% 50V
C128 1-116-405-11 CERAMIC
CHIP 0.01uF 10% 100V
C129 1-162-968-91 CERAMIC
CHIP 0.0047uF 10% 50V
C130 1-114-324-11 CERAMIC
CHIP 0.022uF 10% 50V
C131 1-124-635-00 ELECT
220uF 20% 6.3V
C132 1-114-811-11 CERAMIC
CHIP 0.0033uF 10% 50V
C133 1-114-811-11 CERAMIC
CHIP 0.0033uF 10% 50V
C134 1-114-811-11 CERAMIC
CHIP 0.0033uF 10% 50V
C135 1-114-811-11 CERAMIC
CHIP 0.0033uF 10% 50V
C137 1-126-795-11 ELECT
10uF
20% 50V
C138 1-118-361-11 CERAMIC
CHIP 0.1uF
10% 50V
C140 1-118-361-11 CERAMIC
CHIP 0.1uF
10% 50V
C141 1-118-361-11 CERAMIC
CHIP 0.1uF
10% 50V
C142 1-118-361-11 CERAMIC
CHIP 0.1uF
10% 50V
C143 1-118-361-11 CERAMIC
CHIP 0.1uF
10% 50V
(DH750)
C148 1-164-230-11 CERAMIC
CHIP 220PF 5% 50V
(DH750)
C149 1-164-230-11 CERAMIC
CHIP 220PF 5% 50V
(DH750)
< CONNECTOR >
CN102
1-843-898-11 CONNECTOR, FFC (LIF (NON-ZIF)) 29P
CN103
1-843-896-11 CONNECTOR, FFC (LIF (NON-ZIF)) 9P (DH750)
< DIODE >
D103
6-502-398-01 DI SA10QA04
D104
6-503-605-01 DI UDZVTE-172.0B
D106
6-500-400-01 DIODE BAV99-215
D107
6-500-400-01 DIODE BAV99-215
D108
6-500-424-01 DIODE SLI-325DCT31W
D109
6-502-398-01 DI SA10QA04
< ROTARY ENCODER >
EN100
1-418-817-21 ENCODER, ROTARY (INPUT SELECTOR)
EN101
1-418-725-41 ENCODER, ROTARY (12 TYPE)
(MASTER VOLUME)
< FERRITE BEAD >
FB100
1-469-152-11 FERRITE, EMI (SMD) (2012)
< IC >
IC100
6-600-768-01 IC PNA4823M03S0
IC101
8-759-701-01 IC NJM2904M
< JUMPER RESISTOR >
JR100 1-216-864-11 SHORT
CHIP 0
JR101 1-216-864-11 SHORT
CHIP 0
JR102 1-216-864-11 SHORT
CHIP 0
JR103 1-216-864-11 SHORT
CHIP 0
JR104 1-216-864-11 SHORT
CHIP 0
JR105 1-216-864-11 SHORT
CHIP 0
JR106 1-216-864-11 SHORT
CHIP 0
JR107 1-216-864-11 SHORT
CHIP 0
JR108 1-216-864-11 SHORT
CHIP 0
JR109 1-216-864-11 SHORT
CHIP 0
JR110 1-216-864-11 SHORT
CHIP 0
JR111 1-216-864-11 SHORT
CHIP 0
JR112 1-216-864-11 SHORT
CHIP 0
Ref. No.
Part No.
Description
Remark
Ref. No.
Part No.
Description
Remark
The components identi
fi
ed by mark
9
con-
tain con
fi
dential information.
Strictly follow the instructions whenever
the components are repaired and/or re-
placed.
Les composants identi
fi
és par la marque
9
contiennent des informations con
fi
denti-
elles.
Suivre scrupuleusement les instructions
chaque fois qu’un composant est rem-
placé et / ou réparé.
Ver. 1.1