SRS-RA5000
5
Sony CONFIDENTIAL
For Authorized Servicer
SECTION 1
SERVICING NOTES
The SERVICING NOTES contains important information for servicing. Be sure to read this section before repairing the unit.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(
Caution:
Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution:
The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to
fl
ow) than
ordinary solder so use caution not to let solder bridges occur
such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
PROTECT MODE
When the [
1
PAIRING] indicator is
fl
ashing in red, the wireless
speaker has detected an error and the speaker is in protect mode.
Disconnect the AC adaptor from the wireless speaker, reconnect it,
and touch the [
1
PAIRING] button to turn the power on again.
If the situation does not improve, even after turning the speaker off
and on, refer to “4. TROUBLESHOOTING” on page 65.
– Rear view –
– Rear view –
NOTE OF PERFORMING THE OPERATION CHECK IN
THE STATE THAT HEATSINK IS REMOVED
When performing the operation check in the state that the wire-
less speaker is disassembled, it is possible to perform the operation
check in the state that heatsink is removed from MAIN-AMP board.
However, in that case, set the volume to low level and perform the
work in the short time so as a few minutes.
When it is necessary to work in the middle level volume or more, or
a few minutes or more, be sure to perform in the state that heatsink
is installed to the MAIN-AMP board.
heatsink (AMP)
DC JACK board
MAIN-AMP board
heatsink (MB)
SPREADING OF SILICONE GREASE
Silicone grease for heat radiation is spread to the four IC (IC6004
to IC6007) on the MAIN-AMP board and the touching portion of
heatsink (AMP).
When replaced the IC with a new part or replaced the MAIN-AMP
board with a new board, spread the silicon grease to the touching
portion of the IC and heatsink (AMP).
MAIN-AMP board
(Side A)
silicon grease
DC JACK board
heatsink (AMP)
(MAIN-AMP board
touching side)
IC6005
IC6004
IC6006
IC6007
silicon grease
SYS SET
2021/01/20 22:17:49 (GMT+09:00)
