SRS-RA5000
29
Sony CONFIDENTIAL
For Authorized Servicer
2-11. MAIN-AMP BOARD
guide line
Press.
4
EMC sheet
5
MAIN-AMP board
(See Note 1, 2)
1
thermal conduct sheet
(8.0
u
8.0 mm)
1
thermal conduct sheet
(8.0
u
8.0 mm)
1
thermal conduct sheet
(8.0
u
8.0 mm)
front side
rear side
bottom side
2
thermal conduct sheet
(15.0
u
10.0 mm)
2
thermal conduct sheet
(15.0
u
10.0 mm)
3
thermal conduct sheet
(21.0
u
14.0 mm)
3
thermal conduct sheet
(21.0
u
14.0 mm)
front side
rear side
bottom side
– Side view –
EMC sheet
rear side
• Pasting position of the EMC sheet
guide
line
thermal conduct sheet
(8.0
u
8.0 mm)
thermal conduct sheet
(8.0
u
8.0 mm)
IC307
thermal conduct sheet
(8.0
u
8.0 mm)
thermal conduct sheet
(15.0
u
10.0 mm)
thermal conduct sheet
(21.0
u
14.0 mm)
thermal conduct sheet
(15.0
u
10.0 mm)
thermal conduct sheet
(21.0
u
14.0 mm)
guide
line
IC786
guide
line
IC2001
guide
line
IC2302
IC103
IC102
IC101
MAIN-AMP
board block
guide
line
guide
line
guide
line
soft cloth, etc.
Note 3:
When working with the side other than
the bottom side facing downward, lay
a soft cloth, etc. so as not to damage.
• Pasting position of the thermal
conduct sheet
• Pasting position of the thermal conduct sheet
• Pasting position of the thermal
conduct sheet
• Pasting position of the thermal
conduct sheet
• Pasting position of the thermal
conduct sheet
• Pasting position of the thermal
conduct sheet
• Pasting position of the thermal
conduct sheet
Note 1:
When replaced the MAIN-AMP board with a new board, the
MAC address will change. Be sure to refer to “NOTICE OF
MAC ADDRESS CHANGE TO CUSTOMERS” on page 15.
Note 2:
When replaced the MAIN-AMP board with a new board, spread
the silicon grease to the touching portion between the IC6004 to
IC6007 on the MAIN-AMP board and the heatsink (AMP).
SYS SET
2021/01/20 22:17:49 (GMT+09:00)