Sony SCD-XB940, Service Manual

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SECTION 4
DIAGRAMS
4-1. NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
Note on Printed Wiring Board:
•
X : parts extracted from the component side.
•
Y
: parts extracted from the conductor side.
• a : Through hole.
• b : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
Parts on the pattern face side seen from
(Conductor Side) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Component Side) the parts face are indicated.
• Main board is multi-layer printed board.
However, the patterns of intermediate-layer have not been in-
cluded in the diagram.
• Indication of transistor
C
B
These are omitted.
E
Q
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in
Ω
and 1 /
4
W or less unless otherwise
specified.
•
f
: internal component.
•
5
: fusible resistor.
•
C
: panel designation.
• U : B+ Line.
•
V
: B– Line.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : STOP
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
J : SACD
c : CD
I : DIGITAL OUT
• Circuit Boards Location
TRANSFORMER board
POWER board
TK board
AUDIO board
MAIN board DISPLAY board
LOADING board
HP board
AC SW board
Note: The components identified by mark 0 or dotted line
with mark
0
are critical for safety.
Replace only with part number specified.