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MDR-IF3000
TABLE OF CONTENTS
1. GENERAL
............................................................................ 3
2. DISASSEMBLY
2-1. Front Plate (R) Assy ............................................................ 4
2-2. RX Board ............................................................................ 5
2-3. Hanger (R) ........................................................................... 5
2-4. Wiring on the Right Side ..................................................... 6
2-5. Front Plate (L) Assy ............................................................ 6
2-6. BATT Board ........................................................................ 7
2-7. Hanger (L) ........................................................................... 7
2-8. Wiring on the Left Side ....................................................... 8
2-9. Hanger Lid (L) .................................................................... 8
2-10. Wiring on the SW Board ..................................................... 9
2-11. How to Hang the Tension Spring ........................................ 9
3. ELECTRICAL ADJUSTMENTS
Tuning Adjustment ................................................................ 10
Mute ON Position Adjustment .............................................. 10
4. DIAGRAMS
4-1. Circuit Boards Location .................................................... 11
4-2. Printed Wiring Boards – Receiver Section – ..................... 12
4-3. Printed Wiring Boards – Power Section – ......................... 13
4-4. Schematic Diagram – Receiver Section – ......................... 14
4-5. IC Block Diagrams ............................................................ 15
5. EXPLODED VIEWS
5-1. Housing (L) Assy Section ................................................. 16
5-2. Housing (R) Assy Section ................................................. 17
6. ELECTRICAL PARTS LIST
......................................... 18
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
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UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40
°
C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°
C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
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Repair DP-IF3000 with MDR-IF3000.
