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TABLE OF CONTENTS
M-200MC
Flexible Circuit Board Repairing
•
Keep the temperature of the soldering iron around 270˚C during
repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on Chip Component Replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
1. GENERAL
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2. DISASSEMBLY
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2-1. Lid Assy, Cassette ································································· 4
2-2. Lid Assy, Battery Case ·························································· 4
2-3. Cabinet (Rear) Assy ······························································ 5
2-4. Main Board ··········································································· 5
2-5. Microphone, Built-in C-2038 set ·········································· 6
2-6. Speaker, LED Board ····························································· 6
2-7. Mechanism Deck ·································································· 7
2-8. Head, Ceramic (HRPE901, 902) ··········································· 7
3. MECHANICAL ADJUSTMENTS
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4. ELECTRICAL ADJUSTMENTS
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5. DIAGRAMS
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5-1. Block Diagram ···································································· 10
5-2. Printed Wiring Board ·························································· 11
5-3. Schematic Diagram ····························································· 12
6. EXPLODED VIEWS
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6-1. Cabinet Section ··································································· 13
6-2. Mechanism Deck (1) ··························································· 15
6-3. Mechanism Deck (2) ··························································· 16
7. ELECTRICAL PARTS LIST
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