- 3 -
SE-1
RM-ED007
The circuit boards used in these models have been processed using
Lead Free Solder. The boards are identified by the LF logo located
close to the board designation e.g. F1, H1 etc [ see examples ]. The
servicing of these boards requires special precautions to be taken as
outlined below.
Lead Free Soldered Boards
example 1
example 2
Lead Free Solder material must be used to comply with environmental requirements of new solder joints. Lead Free Solder is available under
the following part numbers :
Due to the higher melting point of Lead Free Solder the soldering iron tip temperature needs to be set to 370 degrees centigrade. This requires
soldering equipment capable of accurate temperature control coupled with a good heat recovery characteristics.
For more information on the use of Lead Free Solder, please refer to
http://www.sony-training.com
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CAUTION
SECTION 1 GENERAL
Summary of Contents for KDL-32U2520
Page 9: ... 8 SE 1 RM ED007 SECTION 2 DISASSEMBLY 2 1 STAND REMOVAL 2 2 REAR COVER REMOVAL ...
Page 10: ... 9 SE 1 RM ED007 2 3 SPEAKER REMOVAL 2 4 A1 BOARD REMOVAL ...
Page 12: ... 11 SE 1 RM ED007 2 7 H1 BOARD REMOVAL 2 8 H2 BOARD REMOVAL ...
Page 13: ... 12 SE 1 RM ED007 2 9 H3 BOARD REMOVAL 2 10 BRACKET REMOVAL ...
Page 14: ... 13 SE 1 RM ED007 2 11 LCD PANEL REMOVAL Six screws ...
