1-74
HXC-100/V2 (J, E)
(SY-363 BOARD)
Ref. No.
or Q'ty Part No. SP Description
RB192 1-234-371-21 s RES, NETWORK 47 (1005X4)
RB193 1-234-378-21 s RES, NETWORK 10K (1005X4)
RB194 1-234-378-21 s RES, NETWORK 10K (1005X4)
RB201 1-234-372-21 s RES, NETWORK 100 (1005X4)
RB202 1-234-378-21 s RES, NETWORK 10K (1005X4)
RB203 1-234-378-21 s RES, NETWORK 10K (1005X4)
RB204 1-234-372-21 s RES, NETWORK 100 (1005X4)
RB205 1-234-378-21 s RES, NETWORK 10K (1005X4)
RB207 1-234-372-21 s RES, NETWORK 100 (1005X4)
RB208 1-234-372-21 s RES, NETWORK 100 (1005X4)
RB209 1-234-378-21 s RES, NETWORK 10K (1005X4)
RB501 1-234-372-21 s RES, NETWORK 100 (1005X4)
RB502 1-234-372-21 s RES, NETWORK 100 (1005X4)
RB504 1-234-371-21 s RES, NETWORK 47 (1005X4)
RB505 1-234-371-21 s RES, NETWORK 47 (1005X4)
RB506 1-234-372-21 s RES, NETWORK 100 (1005X4)
RB507 1-234-372-21 s RES, NETWORK 100 (1005X4)
RB508 1-234-372-21 s RES, NETWORK 100 (1005X4)
RB509 1-234-372-21 s RES, NETWORK 100 (1005X4)
RB510 1-234-372-21 s RES, NETWORK 100 (1005X4)
RB511 1-234-372-21 s RES, NETWORK 100 (1005X4)
RB512 1-234-372-21 s RES, NETWORK 100 (1005X4)
RB513 1-234-372-21 s RES, NETWORK 100 (1005X4)
RB514 1-234-372-21 s RES, NETWORK 100 (1005X4)
RB515 1-234-372-21 s RES, NETWORK 100 (1005X4)
RB516 1-234-372-21 s RES, NETWORK 100 (1005X4)
RB517 1-234-372-21 s RES, NETWORK 100 (1005X4)
RB518 1-234-372-21 s RES, NETWORK 100 (1005X4)
RB521 1-234-372-21 s RES, NETWORK 100 (1005X4)
RB522 1-234-372-21 s RES, NETWORK 100 (1005X4)
RB531 1-234-372-21 s RES, NETWORK 100 (1005X4)
RB532 1-234-372-21 s RES, NETWORK 100 (1005X4)
RB561 1-234-378-21 s RES, NETWORK 10K (1005X4)
RB562 1-234-378-21 s RES, NETWORK 10K (1005X4)
RV501 1-225-793-21 s RES, ADJ, CERMET 20K
S101 1-692-270-41 s SWITCH, SLIDE
S102 1-786-725-21 s SWITCH, TACTILE
S201 1-692-270-41 s SWITCH, SLIDE
S502 1-771-796-21 s SWITCH, SLIDE
THP1
!
1-803-615-21 s THERMISTOR, POSITIVE
THP2
!
1-804-616-21 s THERMISTOR, POSITIVE
THP3
!
1-804-616-21 s THERMISTOR, POSITIVE
THP4
!
1-804-616-21 s THERMISTOR, POSITIVE
THP6
!
1-803-615-21 s THERMISTOR, POSITIVE
THP501
!
1-803-353-21 s THERMISTOR, POSITIVE
THP502
!
1-803-353-21 s THERMISTOR, POSITIVE
TP101 1-535-877-22 s CHIP, CHECKER
TP501 1-535-877-22 s CHIP, CHECKER
TP502 1-535-877-22 s CHIP, CHECKER
TP503 1-535-877-22 s CHIP, CHECKER
TP504 1-535-877-22 s CHIP, CHECKER
TP511 1-535-877-22 s CHIP, CHECKER
X101 1-795-561-21 s VIBRATOR, CERAMIC
X102 1-813-480-11 s OSCILLATOR, CRYSTAL
X501 1-813-253-12 s OSCILLATOR, CRYSTAL (VCXO) 5V
------------
TG-265 BOARD
------------
Ref. No.
or Q’ty Part No. SP Description
1pc A-1707-916-A s MOUNTED CIRCUIT BOARD, TG-265
C1 1-100-816-21 s CAP, ELECT 33MF (5.6X6.5)
C4 1-112-692-81 s CAP,CHIP CERAMIC1000PF CH 1005
C5 1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C6 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C7 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C8 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C9 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C10 1-114-548-11 s CAP, NIOBIUM ELECT 22UF
C13 1-164-845-81 s CAP, CHIP CERAMIC 5PF CH 1005
C14 1-114-549-11 s CAP, NIOBIUM ELECT 47UF
C15 1-114-549-11 s CAP, NIOBIUM ELECT 47UF
C17 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C18 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C20 1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C21 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C22 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C23 1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C24 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C25 1-127-956-21 s CAP, CHIP FILM 0.1MF (3225)
C27 1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C28 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C29 1-114-549-11 s CAP, NIOBIUM ELECT 47UF
C30 1-114-549-11 s CAP, NIOBIUM ELECT 47UF
C31 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C32 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C34 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C35 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C36 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C37 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C38 1-135-960-91 s CAP, CHIP CERAMIC 10MF B(3225)
C39 1-127-956-21 s CAP, CHIP FILM 0.1MF (3225)
C40 1-127-956-21 s CAP, CHIP FILM 0.1MF (3225)
C41 1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C42 1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C45 1-112-692-81 s CAP,CHIP CERAMIC1000PF CH 1005
C46 1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C47 1-100-165-21 s CAP, ELECT 47MF (8X7)
C48 1-114-549-11 s CAP, NIOBIUM ELECT 47UF
C49 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C50 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C51 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C52 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C53 1-114-548-11 s CAP, NIOBIUM ELECT 22UF
C54 1-115-339-91 s CAP, CERAMIC 0.1MF B (2012)
C55 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C58 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C59 1-164-845-81 s CAP, CHIP CERAMIC 5PF CH 1005
C60 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C61 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C62 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C63 1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C64 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C66 1-115-339-91 s CAP, CERAMIC 0.1MF B (2012)
C68 1-165-629-91 s CAP, CERAMIC 1000000PF B(3225)
C69 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C70 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C71 1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
Summary of Contents for HXC-100
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