1-48
HXC-100/V2 (J, E)
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MS-91 BOARD
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Ref. No.
or Q’ty Part No. SP Description
1pc A-1708-080-A s MOUNTED CIRCUIT BOARD, MS-91
C1 1-135-960-91 s CAP, CHIP CERAMIC 10MF B(3225)
C2 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C3 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C4 1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C5 1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C6 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C7 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C8 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C9 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C10 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C11 1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C12 1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C19 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C20 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
CN1 1-816-113-21 s CONNECTOR 15P
CN2 1-778-965-21 s CONNECTOR 12P
CN3 1-793-152-21 o CONNECTOR 11P
CN4 1-817-653-42 s MEMORY STICK CONNECTOR
CN5 1-816-562-31 s CONNECTOR, FFC/FPC(ZIF) ST 36P
CN6 1-785-946-21 s CONNECTOR 3P
D3 8-719-989-04 s DIODE DAN222-TL
D4 6-500-122-01 s DIODE CL-375HR/YG-D-TS
FB1 1-400-832-21 s SMD EMI FERRITE
FB2 1-400-832-21 s SMD EMI FERRITE
IC1 6-712-297-01 s IC PCA9555DBR
IC2 6-712-297-01 s IC PCA9555DBR
IC3 6-711-237-01 s IC NJM2878F3-33 (TE2)
IC4 6-706-476-01 s IC TC7SET04FU(T5RSOJF)
IC5 6-706-476-01 s IC TC7SET04FU(T5RSOJF)
IC6 6-711-116-01 s IC NJM2878F3-05 (TE2)
Q3 8-729-928-91 s TRANSISTOR DTC114EE-TL
Q4 8-729-928-91 s TRANSISTOR DTC114EE-TL
R1 1-208-887-81 s RES, CHIP 1.0K (1005)
R2 1-208-887-81 s RES, CHIP 1.0K (1005)
R3 1-208-879-81 s RES, CHIP 470 (1005)
R4 1-208-879-81 s RES, CHIP 470 (1005)
R5 1-208-855-81 s RES, CHIP 47 (1005)
R6 1-208-855-81 s RES, CHIP 47 (1005)
R7 1-208-887-81 s RES, CHIP 1.0K (1005)
R8 1-208-887-81 s RES, CHIP 1.0K (1005)
R10 1-208-855-81 s RES, CHIP 47 (1005)
R11 1-208-855-81 s RES, CHIP 47 (1005)
R12 1-208-887-81 s RES, CHIP 1.0K (1005)
RB7 1-234-370-21 s RES, NETWORK 22 (1005X4)
RB8 1-234-370-21 s RES, NETWORK 22 (1005X4)
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NR-80 BOARD
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Ref. No.
or Q’ty Part No. SP Description
1pc A-1708-086-A s MOUNTED CIRCUIT BOARD, NR-80
C4 1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C5 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C8 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C9 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C10 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C11 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C12 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C13 1-114-548-11 s CAP, NIOBIUM ELECT 22UF
C14 1-114-548-11 s CAP, NIOBIUM ELECT 22UF
C15 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C16 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C17 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C18 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C19 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C20 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C21 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C22 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C23 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C24 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C25 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C26 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C27 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C28 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C29 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C30 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C31 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C32 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C33 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C34 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C35 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C36 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C37 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C38 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C39 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C40 1-114-548-11 s CAP, NIOBIUM ELECT 22UF
C41 1-114-548-11 s CAP, NIOBIUM ELECT 22UF
C49 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C50 1-165-884-91 s CAP, CERAMIC 2.2MF (1608)
C51 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C52 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C53 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C54 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C55 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C56 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C57 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C58 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C59 1-114-548-11 s CAP, NIOBIUM ELECT 22UF
C60 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C61 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C62 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C63 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C64 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C65 1-164-858-81 s CAP, CHIP CERAMIC 22PF CH 1005
C68 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C69 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C70 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C71 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
Summary of Contents for HXC-100
Page 1: ...HD COLOR CAMERA HXC 100 SERVICE MANUAL Volume 2 1st Edition ...
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