Sony HT-MT500, Service Manual

Page: 8 / 66

HT-MT500/MT501
8
BOND FIXED POSITION OF ELECTRICAL PARTS
When the parts that fi xed on the board by the bond have been re-
moved, fi x the parts by using the bond (ADHESIVE (SC608Z2))
in the mounting to the board. (Refer to the fi gure below)
[ ]
: Bond application portion
– BAR-AMP Board (Side A) –
C6219
SPREADING OF COMPOUND
When the IC6001 on the BAR-AMP board or the BAR-AMP board
is replaced, spread the compound to the touching portion between
the IC6001 and the heat sink.
– BAR-AMP Board (Side A) –
IC6001
compound
MALFUNCTION PREVENTION OF THE BUTTON (TOUCH
PANEL SWITCH)
When the button portion on the top side of the main unit are
touched with something such as the
fl oor surface, there is a pos-
sibility of occurring the malfunction.
When performing the operation check in the state that the top side
on this unit is under, set the stand etc. to the position that avoids the
button portion as shown in the
fi gure below, perform in the state
that the button portion does not touch anything.
bottom side
stand
stand
button portion
COLOR VARIATION
HT-MT500
SA-MT500
HT-MT501
SA-MT501
Charcoal
Black
Crème
White
AEP
z z
UK
z z