3
MZ-DH710
Notes on chip component replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
•
Keep the temperature of the soldering iron around 270 ˚C
during repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
TABLE OF CONTENTS
1.
SERVICING NOTES
...............................................
4
2.
GENERAL
...................................................................
5
3.
DISASSEMBLY
3-1.
Disassembly Flow ...........................................................
6
3-2.
Case (Lower) Section ......................................................
7
3-3.
MAIN Board ....................................................................
7
3-4.
Case (Upper) Section .......................................................
8
3-5.
Mechanism Deck Section (MT-MZNH900-181),
MD Standard Pin .............................................................
8
3-6.
Set Chassis Assy ..............................................................
9
3-7.
Gear (BSA), Gear (SB) ...................................................
9
3-8.
OP Service Assy .............................................................. 10
3-9.
DC Motor SSM18D/C-NP (Spindle) (M701),
DC Motor (Sled) (M702),
DC Motor Unit (Over Write Head Up/Down) (M703) ... 10
3-10. Holder Assy ..................................................................... 11
3-11. Position of Ferrite Core ................................................... 11
4.
TEST MODE
.............................................................. 12
5.
ELECTRICAL ADJUSTMENTS
.......................... 16
6.
DIAGRAMS
6-1.
Block Diagram – MD SERVO Section – ........................ 21
6-2.
Block Diagram – POWER SUPPLY Section – ............... 22
6-3.
Printed Wiring Board – MAIN Section (1/2) – ............... 24
6-4.
Printed Wiring Board – MAIN Section (2/2) – ............... 25
6-5.
Schematic Diagram – MAIN Section (1/8) – .................. 26
6-6.
Schematic Diagram – MAIN Section (2/8) – .................. 27
6-7.
Schematic Diagram – MAIN Section (3/8) – .................. 28
6-8.
Schematic Diagram – MAIN Section (4/8) – .................. 29
6-9.
Schematic Diagram – MAIN Section (5/8) – .................. 30
6-10. Schematic Diagram – MAIN Section (6/8) – .................. 31
6-11. Schematic Diagram – MAIN Section (7/8) – .................. 32
6-12. Schematic Diagram – MAIN Section (8/8) – .................. 33
7.
EXPLODED VIEWS
7-1.
Case (Lower) Section ...................................................... 44
7-2.
Case (Upper) Section ....................................................... 45
7-3.
Chassis Section ................................................................ 46
7-4.
Mechanism Deck Section (MT-MZNH900-181) ............ 47
8.
ELECTRICAL PARTS LIST
................................ 48
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE
0
SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE
FONCTIONNEMENT. NE REMPLACER CES COM- POSANTS
QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT
DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
Summary of Contents for Hi-MD WALKMAN MZ-DH710
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