NOTES ON CHIP COMPONENT REPLACEMENT
Never reuse a disconnected chip component.
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
Keep the temperature of soldering iron around 270 °C during
repairing.
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
anufactured under license from Dolby
Laboratories. “ Dolby” and the double-D
symbol are trademarks of Dolby Laboratories.
“DVD VIDEO,” and the “CD” logos are
trademarks.
PEG Layer-3 audio coding technology and
patents licensed from Fraunhofer IIS and
Thomson.
registered trademarks of Sony Corporation.
DHC Logo is a trademark of SD-3C, LLC.
Corporation in the United States and/or other
countries.
his product contains technology subject to
certain intellectual property rights of
osoft. Use or distribution of this
technology outside of this product is
prohibited without the appropriate license(s)
fr
PORTFOL IO LICENSE FOR THE
PERSONAL AND
ENGAGED IN A PERSONAL AND NON-
NO LICENSE IS GRANTED OR SHALL BE
ll other trademarks and registered
trademarks are of their respective holders. In
this manual,
First 3
characters of
the service
number
Clean the disc with a
soft cloth.
Summary of Contents for HCD-SLK10D
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