2
HCD-GNX780/GNX880
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
This appliance is classified as
a CLASS 1 LASER product.
This label is located on the rear
exterior.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE WITH
MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40
°
C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°
C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
Disc player section
System
Compact disc and digital
audio system
Laser
Semiconductor laser
(
λ
=780 nm)
Emission duration: continuous
Laser Output
Max. 44.6
µ
W*
* This output is the value measured at
a distance of 200 mm from the
objective lens surface on the Optical
Pick-up Block with 7 mm aperture.
Frequency response
2 Hz – 20 kHz (
±
0.5 dB)
Wave length
780 – 790 nm
Signal-to-noise ratio
More than 90 dB
Dynamic range
More than 90 dB
OPTICAL CD DIGITAL OUT
(Square optical connector jack, rear panel)
Wave length
660 nm
Output Level
–18 dBm
Tape deck section
Recording system
4-track 2-channel stereo
Frequency response
50 – 13,000 Hz (
±
3 dB),
using Sony TYPE I tape
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range
87.5 – 108.0 MHz
Antenna
FM lead antenna
Antenna terminals
75 ohm unbalanced
Intermediate frequency
10.7 MHz
AM tuner section
Tuning range
530 – 1,710 kHz
(with the interval set at 10 kHz)
531 – 1,710 kHz
(with the interval set at 9 kHz)
Antenna
AM loop antenna
Antenna terminals
External antenna terminal
Intermediate frequency
450 kHz
General
Power requirements
127 V AC, 60Hz
Power consumption
MHC-GNX880
350 watts
MHC-GNX780
250 watts
Dimensions (w/h/d) (Approx.)
281
×
362
×
404.5 mm
Mass (Approx.)
HCD-GNX880
13.7 kg
HCD-GNX780
12.0 kg
Design and specifications are subject to change without notice.
