Sony HCD-DX375, Service Manual

Page: 58 / 104

58 58
HCD-DX375
HCD-DX375
6-25. PRINTED WIRING BOARDS – PANEL SECTION –
•
See page 33 for Circuit Boards Location.
:Uses unleaded solder.
• Semiconductor Location
Ref. No. Location
D431 C-5
D432 C-5
D433 I-6
D470 G-7
D492 I-7
D493 I-7
D496 I-3
D497 I-3
D801 E-13
D802 E-13
D803 D-13
D804 D-13
D805 D-13
D811 G-17
D812 G-16
D813 G-15
Ref. No. Location
D814 G-14
D815 G-13
IC401 H-5
IC402 H-3
IC801 B-7
IC802 D-11
IC803 H-12
Q450 I-4
Q451 I-4
Q460 I-3
Q461 I-4
Q470 H-6
Q471 H-6
Q472 H-7
Ref. No. Location
Q473 H-6
Q474 H-5
Q475 H-6
Q476 H-7
Q801 D-12
Q802 C-9
Q811 H-17
Q812 H-17
Q813 H-16
Q814 H-16
Q815 H-15
Q816 H-15
Q817 H-14
Q818 H-13
Q819 H-13
Q820 H-12
I/ 1
A
H
x X .
> FUNCTION
DISC 5 DISC 4 DISC 3
DISC 2
DISC 1
AUDIO IN
PHONES
VOLUME
–
+
E
E
E
E
4 1
1 5
E
E
E E
E
E E
E
E
E E
E
E
E
E
E E
E
1 3
1 2
D493 D492
12
12
12
12
12
12
12
12
MAIN BOARD
CN501
(Page 48)
A
I/O BOARD
CN312
(Page 56)
L
MAIN BOARD
CN3001
(Page 49)
H
IC803
IC402
IC401
IC801
IC802
2
2
1
4
5
10 1