![Sofraser MIVI 9610 Technical Manual Download Page 3](http://html1.mh-extra.com/html/sofraser/mivi-9610/mivi-9610_technical-manual_1312042003.webp)
Technical Manual MIVI 9612
Réf. 254-31/0
3
TABLE OF CONTENT
1.
GENERAL PRESENTATION ....................................................................................................... 5
1.1.
T
HE SENSOR
............................................................................................................................... 5
1.2.
T
HE PROCESSOR
......................................................................................................................... 5
1.3.
C
HECKING THE EQUIPMENT AT THE RECEIPT
.................................................................................. 6
1.4.
C
HECKING THE EQUIPMENT WHEN PLACED AT THE PROCESS
.......................................................... 6
1.5.
P
ERIODIC CHECKING
.................................................................................................................... 6
1.5.1. Offset adjustment in air ....................................................................................................... 6
1.5.2. Modification of the previous calibration ................................................................................ 7
1.6.
D
IRECTIVES AND
S
TANDARDS
...................................................................................................... 7
1.6.1. Certification ATEX ............................................................................................................... 7
1.6.2. Installation in hazardous area ............................................................................................. 7
1.6.3. European Pressure Equipment Directive ............................................................................. 8
1.6.4. EMC and low voltage directive ............................................................................................ 8
2.
VISCOSITY SENSOR ................................................................................................................... 9
2.1.
V
ARIOUS MODELS
........................................................................................................................ 9
2.2.
S
ENSOR INSTALLATION
................................................................................................................ 9
2.2.1. Elbow mounting ................................................................................................................ 10
2.2.2. Plane side mounting .......................................................................................................... 10
2.2.3. Pot mounting, for small flow rates, or pilot plant ................................................................ 10
2.2.4. Special mountings ............................................................................................................. 10
2.2.5. Replacement cap .............................................................................................................. 10
2.3.
P
RACTICAL ADVICES
.................................................................................................................. 11
2.4.
C
HECKING
................................................................................................................................ 11
2.5.
S
ENSOR WIRING
........................................................................................................................ 11
2.6.
M
ODELS AND DIMENSIONS
......................................................................................................... 13
2.7.
T
IGHTNESS
............................................................................................................................... 14
3.
TRANSDUCER’S MECHANICAL CHARACTERISTICS ............................................................ 15
3.1.
H
OUSING
’
S MECHANICAL CHARACTERISTICS
................................................................................ 15
3.2.
T
RANSDUCER
’
S ELECTRONIC BOARD WIRING
............................................................................... 15
4.
PROCESSOR TECHNICAL CHARACTERISTICS ..................................................................... 16
4.1.
M
ECHANICAL CHARACTERISTICS
................................................................................................. 16
4.2.
D
ISPLAY
................................................................................................................................... 16
4.3.
K
EYBOARD
................................................................................................................................ 16
4.4.
B
ATTERY
.................................................................................................................................. 16
4.5.
C
ONSUMPTION
.......................................................................................................................... 17
4.6.
P
OWER SUPPLY WIRING
............................................................................................................. 17
4.7.
C
ONNECTION BLOCKS
................................................................................................................ 17
4.8.
A
NALOG
I
NPUTS
........................................................................................................................ 18
4.9.
A
NALOG INPUTS CONNECTION
(
DENSIMETERS
) ............................................................................ 18
4.10.
R
ELAY OUTPUTS
...................................................................................................................... 19
4.11.
A
NALOG OUTPUTS
................................................................................................................... 19
4.12.
O
UTPUTS WIRING SCHEME
....................................................................................................... 20
4.13.
G
ENERAL INFORMATION
........................................................................................................... 20
4.14.
W
ASTES HANDLING
.................................................................................................................. 20
5.
MOUNTING THE PROCESSOR - INSTALLATION .................................................................... 21