SMSC USB2601, Datasheet

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4th Generation USB 2.0 Flash Media Controller with Integrated Card Power FETs & HS Hub
Datasheet
SMSC USB2601/USB2602 27 Revision 1.6 (06-20-08)
DATASHEET
Chapter 8 Package Information
8.1 Package Outline
Figure 8.1 USB2601/USB2602 128-Pin TQFP Package Outline
Notes:
1. Controlling Unit: millimeter.
2. Tolerance on the true position of the leads is ± 0.035 mm maximum.
Package body dimensions D1 and E1 do not include the mold protrusion.
3. Maximum mold protrusion is 0.25 mm.
4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5. Details of pin 1 identifier are optional but must be located within the zone indicated.
Table 8.1 USB2601/USB2602 128-Pin TQFP Package Parameters
MIN NOMINAL MAX REMARKS
A ~ ~ 1.20 Overall Package Height
A1 0.05 ~ 0.15 Standoff
A2 0.95 ~ 1.05 Body Thickness
D 15.80 ~ 16.20 X Span
D1 13.80 ~ 14.20 X body Size
E 15.80 ~ 16.20 Y Span
E1 13.80 ~ 14.20 Y body Size
H 0.09 ~ 0.20 Lead Frame Thickness
L 0.45 0.60 0.75 Lead Foot Length
L1 ~ 1.00 ~ Lead Length
e 0.40 Basic Lead Pitch
q 0
o
~ 7
o
Lead Foot Angle
W 0.13 0.18 0.23 Lead Width
R1 0.08 ~ ~ Lead Shoulder Radius
R2 0.08 ~ 0.20 Lead Foot Radius
ccc ~ ~ 0.08 Coplanarity