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paste mask pad openings can be increased to ensure proper soldering and solder wetting over pads.
The following figure is the Ramp-Soak-Spike Reflow Profile of SIM68R:
Figure 14: The Ramp-Soak-Spike reflow profile of SIM68R
SIM68R is Moisture Sensitive Devices (MSD), appropriate MSD handling instruction and precautions are
summarized in Chapter 6.3.
SIM68R modules are also Electrostatic Sensitive Devices (ESD), handling SIM68R modules without proper ESD
protection may destroy or damage them permanently.
Avoid ultrasonic exposure due to internal crystal and SAW components.
6.3
Moisture sensitivity
SIM68R module is moisture sensitive at MSL level 3, dry packed according to IPC/JEDEC specification
J-STD-020C.
The calculated shelf life for dry packed SMD packages is a minimum of 12 months from the bag
seal date, when stored in a non condensing atmospheric environment of <40°C/90% RH.
Table 10 lists floor life for different MSL levels in the IPC/JDEC specification:
Table 12: Moisture Classification Level and Floor Life
Level
Floor Life(out of bag)at factory ambient
≦
+30 /60%RH or as stated
℃
1
Unlimited at
≦
+30 /85% RH
℃
2
1 year
2a
4 weeks
3
168 hours
4
72 hours
5
48 hours
5a
24 hours
6
Mandatory bake before use. After bake, module must be reflowed within
the time limit specified on the label.
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2013-01-22