
RS9116 CC0 Connectivity Module Datasheet v1.0.10, December 2021
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14. Ensure all power supply traces widths are sufficient enough to carry corresponding currents.
15. Add GND copper pour underneath IC/Module in all layers, for better thermal dissipation.
Note:
When using Chip Antenna from vendors, the Chip Antenna layout guidelines provided by the vendor need to
be used.