4115102
Rev 1.1
February 21, 2014
15
Customer Process Guidelines
SMT Assembly Process
4.2.2.
Footprint
The following figure shows the position of the copper pads.
Figure 6.
AirPrime Snap-in Socket Footprint Recommendation
– Copper Layout Position
In order to produce high assembly yields and a reliable solder joint, the footprint design should match
Figure 7 below.
This footprint is compatible for both soldering the module on its own and for soldering a Snap-in
Socket.
For additional information, refer to the product technical specifications listed in section 1.2 Reference
Documents.
