
XT65/XT75 Hardware Interface Overview
7.3 Board-to-Board Application Connector
s
XT65_XT75_HO_v00.130
Page 47 of 67
2006-10-12
Confidential / Preliminary
7.3
Board-to-Board Application Connector
This section provides the specifications of the 80-pin board-to-board connector used to connect XT65/XT75 to
the external application.
Connector mounted on the XT65/XT75 module:
Type:
52991-0808 SlimStack Receptacle 80 pins, 0.50mm pitch, for stacking heights from 3.0 to 4.0mm,
see
Figure 14
for details.
Supplier:
Molex,
http//www.molex.com
Table 19:
Technical specifications of Molex board-to-board connector
Parameter
Specification (80-pin B2B connector)
Electrical
Number of Contacts
80
Contact spacing
0.5mm (.020")
Voltage
50V
Rated current
0.5A max per contact
Contact resistance
50m
Ω
max per contact
Insulation resistance
> 100M
Ω
Dielectric Withstanding Voltage
500V AC (for 1 minute)
Physical
Insulator material (housing)
White glass-filled LCP plastic, flammability UL 94V 0
Contact material
Plating: Gold over nickel
Insertion force 1
st
< 74.4N
Insertion force 30
th
< 65.6N
Withdrawal force 1
st
> 10.8N
Maximum connection cycles
30 (@ 70m
Ω
max per contact)