SIMATIC IFP2200/2400 ITC2200/2400 frameless
A5E48015893-AC, 03/2021
21
Screw mounting
Procedure
1.
Insert the device from the front into the prepared mounting geometry of an enclosure or control cabinet.
The following figure shows an example of the 22"device without rear-side electronics. The devices have 22 threaded
sleeves that point to the rear, see the red markings.
2.
Insert M3 screws of suitable length (see chapter "Installation guidelines (Page 20)") into each threaded sleeve from the rear
and tighten them with a torque of 0.7 Nm.
Connecting the device
Equipotential bonding
Differences in electrical potential
Differences in electrical potential can develop between spatially separate plant components. Such electrical potential
differences can lead to high equalizing currents across the data cables and therefore to the destruction of their interfaces.
Equalizing currents can develop if the cable shielding is terminated at both ends and grounded to different plant parts.
Differences in potential may develop when a system is connected to different mains supplies.
General requirements for equipotential bonding
Differences in potential must be reduced by means of equipotential bonding in order to ensure trouble-free operation of the
relevant components of the electronic system. The following must therefore be observed when installing the equipotential
bonding circuit:
•
The effectiveness of equipotential bonding increases as the impedance of the equipotential bonding conductor decreases
or as its cross-section increases.
•
If two plant components are interconnected by means of shielded data cables and their shielding is bonded at both ends
to the grounding/protective conductor, the impedance of the additionally installed equipotential bonding cable must not
exceed 10 % of the shielding impedance.
•
The cross-section of an equipotential bonding conductor must be capable of handling the maximum equalizing current.
Equipotential bonding cables are required between two control cabinets with a minimum conductor cross-section of
16 mm².
•
Use equipotential bonding conductors made of copper or galvanized steel. Establish a large surface contact between the
equipotential bonding conductors and the grounding/protective conductor and protect them from corrosion.
•
Clamp the shield of the data cable from the device flush at the equipotential bonding rail using suitable cable clamps. The
equipotential bonding rail should be as close as possible to the device.
•
Route the equipotential bonding conductor and data cables in parallel and with minimum clearance in between.
