THEMIS
THEMIS User Manual - Rev. First Edition: 1.0 - Last Edition: 2.2 - Author: A.R. - Reviewed by S.R. -Copyright © 2022 SECO S.p.A.
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4.1
Thermal Design
Highly integrated systems, like the THEMIS board, offer the user excellent performance in a much reduced space, therefore allowing the system
’
s minimization. On
the other hand, the miniaturizing of IC
’
s and the increase of clock frequencies of the processors lead to the generation of a big amount of heat that must be dissipated
to prevent critical operating conditions, system hang-off or failures.
It is extremely important to note that, for this reason, a critical design parameter always to be kept in very high consideration is the thermal design and analysis of the
final assembled system. It is necessary to carefully consider the heat generated by the module in the final assembled system and the application.
The customer must always ensure that the heatspreader/heatsink surface temperature remain within the declared operating temperature range at
any point of the cooling element.
Please always keep in mind that heavy computational tasks will generate much heat, on all versions of the processor.
Therefore, it is always necessary that the customer studies and develops a specifically tailored cooling solution for the final system by evaluating processor
’
s workload,
application environment, system enclosure, air flow and so on.
Warning
!
The thermal solutions available with SECO boards are tested in the commercial temperature range (0-60°C), without housing and inside climatic
chamber. Therefore, the customer is suggested to study, develop and validate the cooling solution for his system, considering ambient
temperature, processor
’
s workload, utilisation scenarios, enclosures, air flow and so on.
In particular, the heatspreader is not intended to be a cooling system by itself, but only as the standard means for transferring heat to cooler, like
heatsinks, cold plate, heat pipes and so on.
