Seagate ST15150DC, Product Manual

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ST15150N/ND/W/WD/WC/DC Product Manual, Rev. D 31
6.2.8 Hot plugging Barracuda 4 disc drives
Caution. Hot-plug drives are not designed for simultaneous power discon-
nection and physical removal.
During power-up and power-down periods, the hot SCSI connect/disconnect
capability does not produce glitches or any corruptions on an active SCSI
bus.
Notes. It is the responsibility of the systems integrator to assure that no
temperature, energy, or voltage hazard is presented during the hot
connect/disconnect operation.
The SCSI bus termination must be external to the drive being
inserted or removed.
Connector J01 must be configured so there is no connection
between the drive and the TRMPWR signal on the SCSI bus.
Removing all term power jumpers accomplishes this.
When installing the drive on a carrier or tray, discharge the static
electricity from the carrier or tray prior to inserting it into the system.
Procedure:
1. Ensure that all I/O processes to the drive you are insertinng or removing
have ceased (for ST15150WC and ST15150DC drives, all I/O processes
on the entire SCSI bus must be inactive). All other devices on the same
SCSI bus must have receivers that conform to the SCSI-3 standard.
2. When inserting a drive, attach the power connector to the drive first, at
least 1 millisecond before attaching the I/O connector to the bus. Maintain
the ground connections during and after connecting the drive to the SCSI
bus.
When removing a drive, disconnect the I/O connector at least 1 millisec-
ond before removing the power connector from the drive, and wait for the
spindle to stop. The disc drive motor should come to a complete stop prior
to changing the plane of operation to ensure data integrity.
Notes. Do not remove or add terminator power or resistance to the SCSI
bus while hot plugging a disc drive.
The power to the electronics and mechanics of the drive may be
simultaneously switched with the bus contacts if the power distribu-
tion system is able to maintain adequate power stability to other
devices during the transition and the grounding requirements are
met by following the instructions provided in step 2.