Seagate Enterprise Capacity 3.5 HDD v7 SAS Product Manual, Rev. C
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9.2
Cooling
Cabinet cooling must be designed by the customer so that the ambient temperature immediately surrounding the drive will not exceed
temperature conditions specified in Section 6.6.1, "Temperature."
The rack, cabinet, or drawer environment for the drive must provide heat removal from the electronics and head and disk assembly (HDA). Users
should confirm that adequate heat removal is provided using the temperature measurement guidelines described in Section 6.6.1.
Forced air flow may be required to keep temperatures at or below the temperatures specified in Section 6.6.1 in which case the drive should be
oriented, or air flow directed, so that the least amount of air flow resistance is created while providing air flow to the electronics and HDA. Also, the
shortest possible path between the air inlet and exit should be chosen to minimize the travel length of air heated by the drive and other heat
sources within the rack, cabinet, or drawer environment.
If forced air is determined to be necessary, possible air-flow patterns are shown in Figure 7. The air-flow patterns are created by one or more fans,
either forcing or drawing air as shown in the illustrations. Conduction, convection, or other forced air-flow patterns are acceptable as long as the
temperature measurement guidelines of Section 6.6.1 are met.
Figure 7.
Air flow
9.3
Drive mounting
Mount the drive using the bottom or side mounting holes. If mounting the drive using the bottom holes, ensure the drive is not physically distorted
by attempting to mount it on a stiff, non-flat surface.
The allowable mounting surface stiffness is 80 lb/in (14.0 N/mm). The following equation and paragraph define the allowable mounting surface
stiffness:
where K is the mounting surface stiffness (units in lb/in or N/mm) and X is the out-of-plane surface distortion (units in inches or millimeters). The
out-of-plane distortion (X) is determined by defining a plane with three of the four mounting points fixed and evaluating the out-of-plane
deflection of the fourth mounting point when a known force (F) is applied to the fourth point.
9.4
Grounding
Signal ground (PCBA) and HDA ground are connected together in the drive and cannot be separated by the user. The equipment in which the drive
is mounted is connected directly to the HDA and PCBA with no electrically isolating shock mounts. If it is desired for the system chassis to not be
connected to the HDA/PCBA ground, the systems integrator or user must provide a nonconductive (electrically isolating) method of mounting the
drive in the host equipment.
Increased radiated emissions may result if users do not provide the maximum surface area ground connection between system ground and drive
ground. This is the system designer’s and integrator’s responsibility.
Note
Image is for reference only, may not represent actual drive.
Above unit
Under unit
Note.
Air flows in the direction shown (back to front)
or in reverse direction (front to back)
Above unit
Under unit
Note.
Air flows in the direction shown or
in reverse direction (side to side)
K x X = F < 15lb = 67N
