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WARNING
Do not use solder containing lead.
This product has been manufactured using lead-free solder in
order to help preserve the environment.
Because of this, be sure to use lead-free solder when carrying
out repair work, and never use solder containing lead.
Lead-free solder has a melting point that is 30 - 40
°
C (86 -
104
°
F) higher than solder containing lead, and moreover it does
not contain lead which attaches easily to other metals. As a
result, it does not melt as easily as solder containing lead, and
soldering will be more difficult even if the temperature of the
soldering iron is increased.
The extra difficulty in soldering means that soldering time will
increase and damage to the components or the circuit board
may easily occur.
Because of this, you should use a soldering iron and solder
that satisfy the following conditions when carrying out repair
work.
Soldering iron
Use a soldering iron which is 70 W or equivalent, and which
lets you adjust the tip temperature up to 450
°
C (842
°
F). It
should also have as good temperature recovery characteris-
tics as possible.
Set the temperature to 350
°
C (662
°
F) or less for chip compo-
nents, to 380
°
C (716
°
F) for lead wires and similar, and to 420
°
C
(788
°
F) when installing and removing shield plates.
The tip of the soldering iron should have a C-cut shape or a
driver shape so that it can contact the circuit board as flat or in
a line as much as possible.
Solder
Use solder with the metal content and composition ratio by
weight given in the table below. Do not use solders which do
not meet these conditions.
Lead-free solder is available for purchase as a service tool.
Use the following part number when ordering:
Part name:
Lead-free solder with resin (0.5 mm dia., 500 g)
Part number:
VJ8-0270
Metal content
Tin (Sn)
Silver (Ag)
Copper (Cu)
Composition
ratio by weight
96.5 %
3.0 %
0.5 %
Note:
If replacing existing solder containing lead with lead-free sol-
der in the soldered parts of products that have been manufac-
tured up until now, remove all of the existing solder at those
parts before applying the lead-free solder.
