Samsung SCX-1100, Service Manual

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3
3-1
Samsung Electronics
CIRCUIT DESCRIPTION
Repair Manual
3. Circuit Description
3-1. GENERAL DESCRIPTION
Main circuit consists of mainly consists of CPU and the controller part with various types of built-in I/O device driver(built-in
RISC Processor Core: ARM7TDMI), system memory part, OA980 controlling input of image received from media and con-
version, CF(COMPACT storage card) interface part. The following nomenclatures by section is the same as those listed in
the circuit diagram.
3-2. MEMORY MAP
The entire Addressing area provided by MAIN CONTROLLER(S3C46MOX(Jupiter3)) is 256MBytes from 0x00000000 to
0x10000000, and the Max. Address Range for each External Chip Select is 32M Byte or Half word from 0x000000 to
0x01FFFFFF and embodied with Big-Endian Bus interface. MEMORY area is divided into EXTERNAL ROM and RAM
areas(See (Figure 1)), and the areas actually used are 2M/8M BYTES SDRAM and 1M BYTES ROM(FLASH MEMORY).
In case of SDRAM, it uses 0xC200000h ~ 0xC3FFFFFh(2MB), and ROM uses 0x0000000h ~ 0x0FFFFFh area.
<Figure 1. S3C46MOX(Jupiter3) MEMORY MAP>
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MAIN PBA