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Samsung Electronics
8
27/19
21/15
28.8
27.2
8.2
8.2
27/19
27/20
26.5
25.2
8.3
8.3
27/19
35/24
31.6
30.4
8.7
8.5
27/19
43/26
38.5
38.8
9.5
9.4
High Pressure
Low Pressure
A-unit
B-unit
A-unit
B-unit
Indoor
(DB/WB)
Cooing
Outdoor
(DB)
2-2 Technical Document (Pressure Graph)
2-2-1 MH18AP1(P2)
■
Cooling(7.5m–Piping)
20
27.2
26.5
31.6
30.4
38.8
38.5
25
30
Outdoor Temperature (
ß
C)
High Pressure (kgf/cm
2
G)
35
40
45
43
39
35
31
27
23
19
15
A-unit
B-unit
25.2
25.2
25.2
28.8
28.8
28.8
20
25
30
Outdoor Temperature (
ß
C)
Low Pressure (kgf/cm
2
G)
35
40
45
9.8
9.6
9.4
9.2
9
8.8
8.6
8.4
8.2
8
8.2
8.2
8.3
9.4
A-unit
B-unit
8.51
8.51
8.28
8.28
8.5
8.3
8.73
8.73
8.7
9.52
9.52
9.5
DB98_16045A(4)_1 1/29/04 4:56 PM Page 8
Summary of Contents for MH18AP1(P2)-09
Page 4: ...MEMO 3 Samsung Electronics ...
Page 63: ...Samsung Electronics 62 8 PCB Diagram 8 1 MAIN PCB Indoor Unit TOP ...
Page 64: ...63 Samsung Electronics PCB Diagram BOTTOM ...
Page 67: ...Samsung Electronics 66 18K 19K 24K 8 2 MAIN PCB Outdoor Unit ...
Page 68: ...PCB Diagram 67 Samsung Electronics 26K ...
Page 73: ...MEMO Samsung Electronics 72 ...
Page 77: ...MEMO Samsung Electronics 76 ...
Page 81: ...MEMO Samsung Electronics 80 ...