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11
Samsung Electronics
Operating Instructions & Technical Document
20/15
–10
23.9
19.6
3.5
3.4
20/15
7
29.0
25.7
6.7
6.7
High Pressure
Low Pressure
A-unit
B-unit
A-unit
B-unit
Indoor
(DB/WB)
Heating
Outdoor
(DB)
■
Heating(15m–Piping)
-15
-10
-5
Outdoor Temperature (
ß
C)
0
5
10
High Pressure (kgf/cm
2
G)
31.5
29.5
27.5
25.5
23.5
21.5
19.5
17.5
15.5
13.5
11.5
29.0
25.7
19.6
27.4
23.8
A-unit
B-unit
23.93
23.93
23.9
-15
-10
-5
Outdoor Temperature (
ß
C)
0
5
10
Low Pressure (kgf/cm
2
G)
7
6.5
6
5.5
5
4.5
4
3.5
3
3.5
3.4
A-unit
B-unit
(5.9)
(5.9)
(27.4)
(27.4)
5.9
6.7
6.7
5.8
DB98_16045A(4)_1 1/29/04 4:56 PM Page 11
Summary of Contents for MH18AP1(P2)-09
Page 4: ...MEMO 3 Samsung Electronics ...
Page 63: ...Samsung Electronics 62 8 PCB Diagram 8 1 MAIN PCB Indoor Unit TOP ...
Page 64: ...63 Samsung Electronics PCB Diagram BOTTOM ...
Page 67: ...Samsung Electronics 66 18K 19K 24K 8 2 MAIN PCB Outdoor Unit ...
Page 68: ...PCB Diagram 67 Samsung Electronics 26K ...
Page 73: ...MEMO Samsung Electronics 72 ...
Page 77: ...MEMO Samsung Electronics 76 ...
Page 81: ...MEMO Samsung Electronics 80 ...