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Operating Instructions & Technical Document
17
Samsung Electronics
27/19
21/15
27.8
26.0
8.7
8.8
27/19
27/20
26.9
24.4
8.6
8.7
27/19
35/24
30.1
29.1
8.8
8.9
27/19
43/26
37.3
37.0
9.0
9.0
High Pressure
Low Pressure
A-unit
B-unit
A-unit
B-unit
Indoor
(DB/WB)
Cooing
Outdoor
(DB)
2-1-1 MH18AP1(P2)
■
Cooling(15m–Piping)
20
25
30
Outdoor Temperature (
ß
C)
35
40
45
High Pressure (kgf/cm
2
G)
39
35
31
27
23
19
15
27.8
26.9
29.1
37.3
26.0
A-unit
B-unit
24.4
24.4
30.1
30.1
37
37
24.4
30.1
37.0
20
25
30
Outdoor Temperature (
ß
C)
35
40
45
Low Pressure (kgf/cm
2
G)
9.5
9.4
9.3
9.2
9.1
9
8.9
8.8
8.7
8.6
8.5
8.8
8.7
8.7
8.6
8.9
8.8
9.0
A-unit
B-unit
9.0
DB98_16045A(4)_1 1/29/04 4:56 PM Page 17
Summary of Contents for MH18AP1(P2)-09
Page 4: ...MEMO 3 Samsung Electronics ...
Page 63: ...Samsung Electronics 62 8 PCB Diagram 8 1 MAIN PCB Indoor Unit TOP ...
Page 64: ...63 Samsung Electronics PCB Diagram BOTTOM ...
Page 67: ...Samsung Electronics 66 18K 19K 24K 8 2 MAIN PCB Outdoor Unit ...
Page 68: ...PCB Diagram 67 Samsung Electronics 26K ...
Page 73: ...MEMO Samsung Electronics 72 ...
Page 77: ...MEMO Samsung Electronics 76 ...
Page 81: ...MEMO Samsung Electronics 80 ...